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1. (WO2017133124) SUBSTRATE POLISHING APPARATUS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/133124 International Application No.: PCT/CN2016/082023
Publication Date: 10.08.2017 International Filing Date: 13.05.2016
IPC:
B24B 37/10 (2012.01)
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37
Lapping machines or devices; Accessories
04
designed for working plane surfaces
07
characterised by the movement of the work or lapping tool
10
for single side lapping
Applicants:
京东方科技集团股份有限公司 BOE TECHNOLOGY GROUP CO., LTD. [CN/CN]; 中国北京市 朝阳区酒仙桥路10号 No.10 Jiuxianqiao Rd. Chaoyang District Beijing 100015, CN
北京京东方显示技术有限公司 BEIJING BOE DISPLAY TECHNOLOGY CO., LTD. [CN/CN]; 中国北京市 经济技术开发区经海一路118号 No.118, Jinghaiyilu, BDA Beijing 100176, CN
Inventors:
胡维勤 HU, Weiqin; CN
陈常旭 CHEN, Changxu; CN
Agent:
中科专利商标代理有限责任公司 CHINA SCIENCE PATENT & TRADEMARK AGENT LTD.; 中国北京市 海淀区西三环北路87号4-1105室 Suite 4-1105, No. 87, West 3rd Ring North Rd. Haidian District Beijing 100089, CN
Priority Data:
201620107882.602.02.2016CN
Title (EN) SUBSTRATE POLISHING APPARATUS
(FR) APPAREIL DE POLISSAGE DE SUBSTRAT
(ZH) 一种基板研磨装置
Abstract:
(EN) A substrate polishing apparatus, comprising an object platform (10), a lifting platform (20), and a polishing head (30). The lifting platform (20) is located above the object platform (10) and can move upward or downward with respect to the object platform (10) along a direction perpendicular to an upper surface of the object platform (10); the polishing head (30) is mounted on the lifting platform (20) and can polish a polishing area of a to-be-polished substrate placed on the object platform (10); the polishing area is a partially scratched area of the to-be-polished substrate.
(FR) L'invention concerne un appareil de polissage de substrat, comprenant une plate-forme d'objet (10), une plate-forme de levage (20) et une tête de polissage (30). La plate-forme de levage (20) est située au-dessus de la plate-forme d'objet (10) et peut se déplacer vers le haut ou vers le bas par rapport à la plate-forme d'objet (10) dans une direction perpendiculaire à une surface supérieure de la plate-forme d'objet (10) ; la tête de polissage (30) est montée sur la plate-forme de levage (20) et peut polir une zone de polissage d'un substrat à polir placé sur la plate-forme d'objet (10) ; la zone de polissage est une zone partiellement rayée du substrat à polir.
(ZH) 一种基板研磨装置,包括载物台(10)、升降台(20)和磨头(30),升降台(20)位于载物台(10)上方,升降台(20)可沿垂直于载物台(10)的上表面的方向相对载物台(10)做升降移动;磨头(30)安装在升降台(20)上,磨头(30)可对放置在载物台(10)上的待研磨基板的研磨区进行研磨,研磨区为待研磨基板上有局部划痕的区域。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)
Also published as:
US20180056471