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1. (WO2017133116) DISPLAY DEVICE AND CHIP CONNECTION METHOD THEREOF
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/133116 International Application No.: PCT/CN2016/081698
Publication Date: 10.08.2017 International Filing Date: 11.05.2016
IPC:
H01L 23/48 (2006.01) ,H01L 23/528 (2006.01) ,H05K 1/11 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
52
Arrangements for conducting electric current within the device in operation from one component to another
522
including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
528
Layout of the interconnection structure
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
11
Printed elements for providing electric connections to or between printed circuits
Applicants:
京东方科技集团股份有限公司 BOE TECHNOLOGY GROUP CO., LTD. [CN/CN]; 中国北京市 朝阳区酒仙桥路10号 No. 10 Jiuxianqiao Rd., Chaoyang District Beijing 100015, CN
Inventors:
陈立强 CHEN, Liqiang; CN
李红 LI, Hong; CN
Agent:
北京市柳沈律师事务所 LIU, SHEN & ASSOCIATES; 中国北京市 海淀区彩和坊路10号1号楼10层 10th Floor, Building 1 10 Caihefang Road Haidian District Beijing 100080, CN
Priority Data:
201610081276.604.02.2016CN
Title (EN) DISPLAY DEVICE AND CHIP CONNECTION METHOD THEREOF
(FR) DISPOSITIF D’AFFICHAGE ET SON PROCÉDÉ DE CONNEXION DE PUCE
(ZH) 显示装置及其芯片连接方法
Abstract:
(EN) A display device and a chip connection method thereof. The display device comprises a flexible display panel (10) and a chip (20) connected to a non-display area (B) of the flexible display panel (10). According to areas where pins (30) are located, extension directions of the pins (30) meet the following conditions: in each row of pins (30), extension lines of at least pins (30) located in a side area at the same end intersect at the same point on a reference line (40); angles between the reference line (40) and respective extension lines of two pins (30) belonging to one pin group are equal.
(FR) La présente invention se rapporte à un dispositif d'affichage et à un procédé de connexion de puce correspondant. Le dispositif d'affichage comprend un écran d'affichage souple (10) et une puce (20) connectée à une zone de non affichage (B) de l'écran d'affichage souple (10). En fonction des zones dans lesquelles des broches (30) sont placées, les directions d'extension des broches (30) satisfont les conditions suivantes : dans chaque rangée de broches (30), des lignes de prolongement de broches au moins (30) placées dans une zone latérale à la même extrémité se croisent au même point sur une ligne de référence (40) ; les angles entre la ligne de référence (40) et des lignes de prolongement respectives de deux broches (30) appartenant à un même groupe de broches sont égaux.
(ZH) 一种显示装置及其芯片连接方法,包括柔性显示面板(10)以及连接在柔性显示面板(10)的非显示区域(B)的芯片(20),各引脚(30)的延伸方向根据所在的区域满足以下条件:每一排引脚(30)中,至少位于侧区域的各引脚(30)沿同一端的延长线汇聚于基准线(40)上的同一点,属于同一引脚组中的两个引脚(30)各自的延长线与基准线(40)的夹角相等。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)
Also published as:
US20180047314