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1. WO2017133090 - CHIP ON FILM, FLEXIBLE DISPLAY PANEL, AND DISPLAY DEVICE

Publication Number WO/2017/133090
Publication Date 10.08.2017
International Application No. PCT/CN2016/080682
International Filing Date 29.04.2016
IPC
G09G 3/20 2006.01
GPHYSICS
09EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
3Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
20for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix
G02F 1/133 2006.01
GPHYSICS
02OPTICS
FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
1Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
01for the control of the intensity, phase, polarisation or colour
13based on liquid crystals, e.g. single liquid crystal display cells
133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
G09F 9/30 2006.01
GPHYSICS
09EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
CPC
G02F 1/13458
GPHYSICS
02OPTICS
FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
1Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
01for the control of the intensity, phase, polarisation or colour 
13based on liquid crystals, e.g. single liquid crystal display cells
133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
1333Constructional arrangements; ; Manufacturing methods
1345Conductors connecting electrodes to cell terminals
13458Terminal pads
G09F 9/00
GPHYSICS
09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
H01L 23/49827
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; ; Selection of materials therefor
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
49827Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
H01L 23/49838
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; ; Selection of materials therefor
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
49838Geometry or layout
H01L 23/4985
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; ; Selection of materials therefor
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
4985Flexible insulating substrates
H01L 23/5384
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
52Arrangements for conducting electric current within the device in operation from one component to another ; , i.e. interconnections, e.g. wires, lead frames
538the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
5384Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
Applicants
  • 京东方科技集团股份有限公司 BOE TECHNOLOGY GROUP CO., LTD. [CN]/[CN]
Inventors
  • 李红 LI, Hong
  • 陈立强 CHEN, Liqiang
  • 周伟峰 ZHOU, Weifeng
Agents
  • 中科专利商标代理有限责任公司 CHINA SCIENCE PATENT & TRADEMARK AGENT LTD.
Priority Data
201610080878.X04.02.2016CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) CHIP ON FILM, FLEXIBLE DISPLAY PANEL, AND DISPLAY DEVICE
(FR) PUCE SUR FILM, PANNEAU D'AFFICHAGE SOUPLE, ET DISPOSITIF D'AFFICHAGE
(ZH) 覆晶薄膜、柔性显示面板及显示装置
Abstract
(EN)
A chip on film, flexible display panel, and display device. The chip on film comprises at least one row of multiple independent output pads (21) arranged in a first direction on one side of a substrate (20), the output pads (21) respectively having a virtual extension line (22) intersecting a reference line (30) at the same intersection point (P2). The flexible display panel comprises at least one row of multiple independent input pads (11) arranged in the first direction and disposed in a bonding region (A). Virtual extension lines (12) of respective input pads (11) intersect the reference line (30) on the same intersection point (P1). If the size of the flexible display panel in the first direction is changed, inclination angles of the output pads (21) and the input pads (11) with respect to the reference line (30) enables relative positions of the flexible display panel and the chip on film in a direction perpendicular to the first direction to be adjusted before bonding is preformed, thus achieving correct alignment of the output pads (21) and a fan-out lead wire, and accordingly improving the pass rate and reliability of bonding.
(FR)
L'invention concerne une puce sur film, un panneau d'affichage souple, et un dispositif d'affichage. La puce sur film comprend au moins une rangée de multiples plots de sortie indépendants (21) agencés dans une première direction sur un côté d'un substrat (20), les plots de sortie (21) présentant respectivement une ligne d'extension virtuelle (22) croisant une ligne de référence (30) au même point d'intersection (P2). Le panneau d'affichage souple comprend au moins une rangée de multiples plots d'entrée indépendants (11) agencés dans la première direction et disposés dans une région de liaison (A). Des lignes d'extension virtuelles (12) de plots d'entrée respectifs (11) croisent la ligne de référence (30) sur le même point d'intersection (P1). Si la taille du panneau d'affichage souple dans la première direction est modifiée, des angles d'inclinaison des plots de sortie (21) et des plots d'entrée (11) relativement à la ligne de référence (30) permettent à des positions relatives du panneau d'affichage souple et à la puce sur film dans une direction perpendiculaire à la première direction d'être réglées avant la réalisation de la liaison, ce qui permet d'obtenir un juste alignement des plots de sortie (21) et d'un fil conducteur de sortance, et par conséquent d'améliorer le taux de réussite et la fiabilité de liaison.
(ZH)
一种覆晶薄膜、柔性显示面板及显示装置。覆晶薄膜包括设置在基材(20)一侧的至少一排沿着第一方向排列的多个相互独立的输出垫(21),各输出垫(21)的虚拟延长线(22)相交于基准线(30)上的同一交汇点(P2)。柔性显示面板包括设置在绑定区(A)内的至少一排沿着第一方向排列的多个相互独立的输入垫(11);各输入垫(11)的虚拟延长线(12)相交于基准线(30)上的同一交汇点(P1)。当柔性显示面板的尺寸沿第一方向发生变化时,由于输出垫(21)和输入垫(11)均与基准线(30)具有一定的倾斜角度,因此可以在调节柔性显示面板与覆晶薄膜在垂直于第一方向的方向上的相对位置后再进行绑定,从而实现输出垫(21)与扇出引线的正确对位,从而提升绑定良率和可靠性。
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