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1. (WO2017132027) WEDGE BONDING TOOLS, WEDGE BONDING SYSTEMS, AND RELATED METHODS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/132027 International Application No.: PCT/US2017/013951
Publication Date: 03.08.2017 International Filing Date: 18.01.2017
IPC:
H01L 23/00 (2006.01) ,H01L 23/495 (2006.01) ,H01L 21/48 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488
consisting of soldered or bonded constructions
495
Lead-frames
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
48
Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/06-H01L21/326201
Applicants:
ORTHODYNE ELECTRONICS CORPORATION [US/US]; 1209 Orange Street Wilmington, DE 19801, US
Inventors:
DEANGELIS, Dominick, A.; US
Agent:
SPLETZER, Christopher, M.; US
ROSSI, Joseph, D.; US
FORET, Philip, J.; US
O'DONOGHUE, Elizabeth, M.; US
CASEY, Kevin, R.; US
Priority Data:
62/287,14826.01.2016US
Title (EN) WEDGE BONDING TOOLS, WEDGE BONDING SYSTEMS, AND RELATED METHODS
(FR) OUTILS DE SOUDURE EN COIN, SYSTÈMES DE SOUDURE EN COIN ET PROCÉDÉS APPARENTÉS
Abstract:
(EN) A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.
(FR) L’invention concerne un outil de soudure en coin comprenant une partie corps comportant une partie pointe. La partie pointe comprend une surface de travail configurée pour venir en contact avec un matériau de fil pendant la formation d'une soudure en coin. Une pluralité d'entailles est définie par une ou plusieurs surfaces de la partie corps.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP3408864