Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO2017131984) EMI SHIELD FOR AN ELECTRONIC OPTICAL DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/131984 International Application No.: PCT/US2017/013625
Publication Date: 03.08.2017 International Filing Date: 16.01.2017
IPC:
H05K 9/00 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
9
Screening of apparatus or components against electric or magnetic fields
Applicants:
MICROSOFT TECHNOLOGY LICENSING, LLC [US/US]; Attn: Patent Group Docketing (Bldg. 8/1000) One Microsoft Way Redmond, Washington 98052-6399, US
Inventors:
PRICE, Raymond Kirk; US
NALLA, Ravi Kiran; US
Agent:
MINHAS, Sandip; US
CHEN, Wei-Chen Nicholas; US
DRAKOS, Katherine J.; US
KADOURA, Judy M.; US
HOLMES, Danielle J.; US
SWAIN, Cassandra T.; US
WONG, Thomas S.; US
CHOI, Daniel; US
Priority Data:
15/007,56827.01.2016US
Title (EN) EMI SHIELD FOR AN ELECTRONIC OPTICAL DEVICE
(FR) BOUCLIER EMI POUR UN DISPOSITIF OPTIQUE ÉLECTRONIQUE
Abstract:
(EN) A system and method are disclosed for shielding EMI in an electronic device such as a depth sensor used in a head mounted display device. In embodiments, the shield has a dual construction including a fence that may be surface mounted to a substrate over a first set of surface mounted components. The EMI shield may further comprise a cover, which may be glued to the fence after a second set of components is mounted to the substrate.
(FR) L'invention concerne un système et un procédé de protection contre les interférences électromagnétiques (EMI) dans un dispositif électronique tel qu'un capteur de profondeur utilisé dans un visiocasque. Dans des modes de réalisation, le blindage comporte une double construction comprenant une clôture qui peut être montée en surface sur un substrat sur un premier ensemble de composants montés en surface. Le blindage EMI peut en outre comprendre un couvercle, qui peut être collé à la clôture après qu'un second ensemble de composants a été monté sur le substrat.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)