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1. (WO2017131830) SINGLE BASE MULTI-FLOATING SURFACE COOLING SOLUTION
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/131830 International Application No.: PCT/US2016/060341
Publication Date: 03.08.2017 International Filing Date: 03.11.2016
IPC:
H01L 23/367 (2006.01) ,H01L 23/427 (2006.01) ,H01L 23/46 (2006.01) ,H01L 25/11 (2006.01) ,H01L 25/18 (2006.01) ,G06F 1/20 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
367
Cooling facilitated by shape of device
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
42
Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
427
Cooling by change of state, e.g. use of heat pipes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
46
involving the transfer of heat by flowing fluids
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
10
the devices having separate containers
11
the devices being of a type provided for in group H01L29/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18
the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
1
Details not covered by groups G06F3/-G06F13/82
16
Constructional details or arrangements
20
Cooling means
Applicants:
INTEL CORPORATION [US/US]; 2200 Mission College Boulevard Santa Clara, California 95054, US
Inventors:
SMALLEY, Jeffory L.; US
SMITH, Susan F.; US
HUYNH, Thu; US
PRAKASH, Mani; US
Agent:
BRASK, Justin, K.; US
Priority Data:
15/197,12929.06.2016US
62/289,22230.01.2016US
Title (EN) SINGLE BASE MULTI-FLOATING SURFACE COOLING SOLUTION
(FR) SOLUTION DE REFROIDISSEMENT MULTI-SURFACE FLOTTANTE DE BASE UNIQUE
Abstract:
(EN) An apparatus including a primary device and at least one secondary device coupled to a substrate; a heat exchanger disposed on the primary device and on the at least one secondary device, wherein the heat exchanger includes at least one portion disposed over an area corresponding to the primary device or the at least one second device including a deflectable surface; and at least one thermally conductive conduit coupled to the heat exchanger. A method including placing a heat exchanger on a multi-chip package, the heat exchanger including the heat exchanger including at least one floating section operable to move in a direction toward or away from at least one of the plurality of dice and at least one thermally conductive conduit disposed in a channel of the heat exchanger and connected to the at least one floating section; and coupling the heat exchanger to the multi-chip package.
(FR) La présente invention porte sur un appareil comprenant un dispositif primaire et au moins un dispositif secondaire couplés à un substrat ; un échangeur thermique disposé sur le dispositif primaire et sur ledit dispositif secondaire, l'échangeur thermique comprenant au moins une partie disposée sur une zone correspondant au dispositif primaire ou à ledit dispositif secondaire comprenant une surface déformable ; et au moins un conduit conducteur de chaleur couplé à l'échangeur thermique. La présente invention porte également sur un procédé comprenant les étapes consistant à placer un échangeur thermique sur un boîtier multi-puce, l'échangeur thermique comprenant au moins une section flottante apte à se déplacer dans une direction vers ou en s'éloignant de la pluralité de dés et au moins un conduit conducteur de chaleur disposé dans un canal de l'échangeur thermique et connecté à l'au moins une section flottante ; et coupler l'échangeur thermique au boîtier multi-puce.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)