Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO2017131688) HEAT TRANSFER ADAPTER PLATE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/131688 International Application No.: PCT/US2016/015280
Publication Date: 03.08.2017 International Filing Date: 28.01.2016
IPC:
H05K 7/20 (2006.01) ,H01L 23/34 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
Applicants:
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP [US/US]; Hewlett Packard Enterprise Development LP 11445 Compaq Center Drive West Houston, Texas 77070, US
Inventors:
FRANZ, John P.; US
HANNA, Charles R.; US
PURCELL, Brian T.; US
Agent:
ADEKUNLE, Olaolu O.; US
Priority Data:
Title (EN) HEAT TRANSFER ADAPTER PLATE
(FR) PLAQUE D’ADAPTATION DE TRANSFERT THERMIQUE
Abstract:
(EN) Example implementations relate to a heat transfer adapter plate. For example, a heat transfer adapter plate can comprise a first retention mechanism to couple a heat transfer device to the heat transfer adapter plate and a second retention mechanism to couple the heat transfer adapter plate to an electronic component. The heat transfer adapter plate can accept a plurality of heat transfer device types, including but not limited to, a passive heat exchanger, an active heat exchanger, and a heat pipe.
(FR) Des exemples de modes de réalisation concernent une plaque d’adaptation de transfert thermique. Par exemple, une plaque d’adaptateur de transfert thermique peut comprendre un premier mécanisme de retenue servant à coupler un dispositif de transfert thermique à la plaque d’adaptation de transfert thermique et un deuxième mécanisme de retenue servant à coupler la plaque d’adaptation de transfert thermique à un composant électronique. La plaque d’adaptation de transfert thermique peut accepter une pluralité de types de dispositif de transfert thermique, tels que, mais sans s’y limiter, un échangeur de chaleur passif, un échangeur de chaleur actif et un caloduc.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
US20190074239