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1. (WO2017131638) SEMICONDUCTOR ASSEMBLY
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/131638 International Application No.: PCT/US2016/014927
Publication Date: 03.08.2017 International Filing Date: 26.01.2016
IPC:
H05K 7/14 (2006.01) ,H05K 7/20 (2006.01) ,H01R 12/71 (2011.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
14
Mounting supporting structure in casing or on frame or rack
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
12
Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards (PCBs), flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
70
Coupling devices
71
for rigid printing circuits or like structures
Applicants:
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP [US/US]; 11445 Compaq Center Drive West Houston, Texas 77070, US
Inventors:
LEIGH, Kevin B.; US
MEGASON, George D.; US
Agent:
ADEKUNLE, Olaolu O.; US
Priority Data:
Title (EN) SEMICONDUCTOR ASSEMBLY
(FR) ENSEMBLE À SEMI-CONDUCTEUR
Abstract:
(EN) An example semiconductor assembly can include a hingeably-coupled component that receives a semiconductor board. In some examples, the component can be hingeably rotated to an open position to receive the semiconductor board. In some examples, the component can be hingeably detached from the assembly to receive the semiconductor board.
(FR) Un exemple d'ensemble à semi-conducteur selon la présente invention peut comprendre un composant relié de manière articulée qui reçoit une plaquette à semi-conducteur. Dans certains exemples, le composant peut être tourné de manière articulée dans une position ouverte pour recevoir la plaquette à semi-conducteur. Dans certains exemples, le composant peut être détaché de manière articulée de l'ensemble pour recevoir la plaquette à semi-conducteur.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
US20190045650