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1. (WO2017131044) CIRCUIT STRUCTURE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/131044 International Application No.: PCT/JP2017/002580
Publication Date: 03.08.2017 International Filing Date: 25.01.2017
IPC:
B60R 16/02 (2006.01) ,H02G 3/16 (2006.01) ,H05K 1/14 (2006.01) ,H05K 7/06 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
60
VEHICLES IN GENERAL
R
VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
16
Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
02
electric
H ELECTRICITY
02
GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
G
INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
3
Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
02
Details
08
Distribution boxes; Connection or junction boxes
16
structurally associated with support for line-connecting terminals within the box
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
14
Structural association of two or more printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
02
Arrangements of circuit components or wiring on supporting structure
06
on insulating boards
Applicants:
株式会社オートネットワーク技術研究所 AUTONETWORKS TECHNOLOGIES,LTD. [JP/JP]; 三重県四日市市西末広町1番14号 1-14, Nishisuehiro-cho, Yokkaichi-shi, Mie 5108503, JP
住友電装株式会社 SUMITOMO WIRING SYSTEMS,LTD. [JP/JP]; 三重県四日市市西末広町1番14号 1-14, Nishisuehiro-cho, Yokkaichi-shi, Mie 5108503, JP
住友電気工業株式会社 SUMITOMO ELECTRIC INDUSTRIES, LTD. [JP/JP]; 大阪府大阪市中央区北浜四丁目5番33号 5-33, Kitahama 4-chome, Chuo-ku, Osaka-shi, Osaka 5410041, JP
Inventors:
陳 登 CHIN, Tou; JP
中村 有延 NAKAMURA, Arinobu; JP
Agent:
山野 宏 YAMANO, Hiroshi; JP
Priority Data:
2016-01368927.01.2016JP
Title (EN) CIRCUIT STRUCTURE
(FR) STRUCTURE DE CIRCUIT
(JA) 回路構成体
Abstract:
(EN) A circuit structure provided with: a circuit substrate having one surface on which a circuit pattern is formed; a plurality of bus bars constituting part of a power circuit, the bus bars being fixed to the other surface of the circuit substrate with a gap therebetween; a first terminal spanning the gap between two adjacent bus bars among the plurality of bus bars, the first terminal being electrically connected to one of the bus bars; an electronic component having a second terminal that is electrically connected to the circuit pattern of the circuit substrate; and a flexible sheet member fixed to the one bus bar, the flexible sheet member electrically connecting the second terminal and the circuit pattern while insulating the one bus bar and the second terminal. The flexible sheet member has an adhesive layer fixed to the one bus bar, a conductor foil for a terminal that electrically connects the second terminal and the circuit pattern, and an insulation layer interposed between the adhesive layer and the conductor foil for a terminal, the insulation layer insulating the one bus bar and the conductor foil for a terminal.
(FR) La présente invention concerne une structure de circuit qui comporte : un substrat de circuit ayant une surface sur laquelle est formé un tracé de circuit ; une pluralité de barres omnibus constituant une partie d'un circuit électrique, les barres omnibus étant fixées sur l'autre surface du substrat de circuit, un espace les séparant ; une première borne couvrant l'espace entre deux barres omnibus adjacentes parmi la pluralité de barres omnibus, la première borne étant électriquement connectée à une des barres omnibus ; un composant électronique ayant une seconde borne qui est électriquement connectée au tracé de circuit du substrat de circuit ; et un élément de feuille souple fixé à ladite barre omnibus, l'élément de feuille souple connectant électriquement la seconde borne et le tracé de circuit tout en isolant ladite barre omnibus et la seconde borne. L'élément de feuille souple possède une couche adhésive fixée à ladite barre omnibus, une feuille conductrice pour une borne qui connecte électriquement la seconde borne et le tracé de circuit et une couche isolante intercalée entre la couche adhésive et la feuille conductrice pour une borne, la couche isolante isolant ladite barre omnibus et la feuille conductrice pour une borne.
(JA) 回路パターンが形成された一面を有する回路基板と、電力回路を構成し、前記回路基板の他面に互いに間隔を開けて固定される複数のバスバと、前記複数のバスバのうち隣り合う2つのバスバの前記間隔を跨ぎ、その一方のバスバに電気的に接続される第1端子と、前記回路基板の回路パターンに電気的に接続される第2端子とを有する電子部品と、前記一方のバスバに固定されて、前記一方のバスバと前記第2端子とを絶縁しつつ前記第2端子と前記回路パターンとを電気的に接続するフレキシブルシート部材とを備え、前記フレキシブルシート部材は、前記一方のバスバに固定される接着層と、前記第2端子と前記回路パターンとを電気的に接続する端子用導体箔と、前記接着層と前記端子用導体箔との間に介在されて、前記一方のバスバと前記端子用導体箔とを絶縁する絶縁層とを有する回路構成体。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN108463375DE112017000521US20180368249