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1. WO2017131006 - RESIN COMPOSITION, THERMALLY CONDUCTIVE MATERIAL, AND DEVICE INCLUDING SURFACE-MODIFIED INORGANIC SUBSTANCE

Publication Number WO/2017/131006
Publication Date 03.08.2017
International Application No. PCT/JP2017/002468
International Filing Date 25.01.2017
Chapter 2 Demand Filed 26.10.2017
IPC
C08L 63/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C08K 9/04 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
9Use of pretreated ingredients
04Ingredients treated with organic substances
C09K 5/14 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
5Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
08Materials not undergoing a change of physical state when used
14Solid materials, e.g. powdery or granular
C01B 21/064 2006.01
CCHEMISTRY; METALLURGY
01INORGANIC CHEMISTRY
BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF
21Nitrogen; Compounds thereof
06Binary compounds of nitrogen with metals, with silicon, or with boron
064with boron
C08J 5/18 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5Manufacture of articles or shaped materials containing macromolecular substances
18Manufacture of films or sheets
CPC
C01B 21/064
CCHEMISTRY; METALLURGY
01INORGANIC CHEMISTRY
BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; ; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
21Nitrogen; Compounds thereof
06Binary compounds of nitrogen with metals, with silicon, or with boron, ; or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
064with boron
C01B 21/068
CCHEMISTRY; METALLURGY
01INORGANIC CHEMISTRY
BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; ; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
21Nitrogen; Compounds thereof
06Binary compounds of nitrogen with metals, with silicon, or with boron, ; or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
068with silicon
C01B 21/072
CCHEMISTRY; METALLURGY
01INORGANIC CHEMISTRY
BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; ; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
21Nitrogen; Compounds thereof
06Binary compounds of nitrogen with metals, with silicon, or with boron, ; or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
072with aluminium
C08G 65/18
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
65Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
02from cyclic ethers by opening of the heterocyclic ring
04from cyclic ethers only
06Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
16Cyclic ethers having four or more ring atoms
18Oxetanes
C08G 65/22
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
65Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
02from cyclic ethers by opening of the heterocyclic ring
04from cyclic ethers only
22Cyclic ethers having at least one atom other than carbon and hydrogen outside the ring
C08J 5/18
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G
5Manufacture of articles or shaped materials containing macromolecular substances
18Manufacture of films or sheets
Applicants
  • 富士フイルム株式会社 FUJIFILM CORPORATION [JP]/[JP]
Inventors
  • 高橋 慶太 TAKAHASHI Keita
Agents
  • 特許業務法人特許事務所サイクス SIKS & CO.
Priority Data
2016-01261726.01.2016JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) RESIN COMPOSITION, THERMALLY CONDUCTIVE MATERIAL, AND DEVICE INCLUDING SURFACE-MODIFIED INORGANIC SUBSTANCE
(FR) COMPOSITION DE RÉSINE, MATÉRIAU THERMIQUEMENT CONDUCTEUR, ET DISPOSITIF COMPRENANT UNE SUBSTANCE INORGANIQUE MODIFIÉE EN SURFACE
(JA) 表面修飾無機物を含む樹脂組成物、熱伝導材料、およびデバイス
Abstract
(EN)
The present invention provides: a resin composition including a surface-modified inorganic substance in which an inorganic nitride or an inorganic oxide is surface-modified with a boronic acid compound, and an epoxy compound; a thermally conductive material including a cured product of said resin composition; and a device including said thermally conductive material. Said boronic acid compound comprises, for example, an amino group, a thiol group, a hydroxyl group, an isocyanate group, a carboxyl group, or a carbonic acid anhydride group. By using the resin composition according to the present invention, a thermally conductive material having a good thermal conductivity and a device having a high durability can be provided.
(FR)
La présente invention décrit : une composition de résine comprenant une substance inorganique modifiée en surface dans laquelle un nitrure inorganique ou un oxyde inorganique est modifié en surface avec un composé d’acide boronique, et un composé époxy ; un matériau thermiquement conducteur comprenant un produit durci de ladite composition de résine ; et un dispositif comprenant ledit matériau thermiquement conducteur. Ledit composé d’acide boronique comprenant, par exemple, un groupe amino, un groupe thiol, un groupe hydroxyle, un groupe isocyanate, un groupe carboxyle, ou un groupe anhydride d’acide carbonique. En utilisant la composition de résine selon la présente invention, un matériau thermiquement conducteur présentant une bonne conductivité thermique et un dispositif présentant une durabilité élevée peuvent être obtenus.
(JA)
本発明により、無機窒化物または無機酸化物がボロン酸化合物で表面修飾された表面修飾無機物およびエポキシ化合物を含む樹脂組成物、上記樹脂組成物の硬化物を含む熱伝導材料、ならびに上記熱伝導材料を含むデバイスが提供される。上記ボロン酸化合物は、例えばアミノ基、チオール基、水酸基、イソシアネート基、カルボキシル基、または無水カルボン酸基を有する。本発明の樹脂組成物を用いて熱伝導性の良好な熱伝導材料、および耐久性の高いデバイスを提供することができる。
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