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1. (WO2017130914) LASER MACHINING DEVICE AND LASER MACHINING METHOD
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/130914 International Application No.: PCT/JP2017/002168
Publication Date: 03.08.2017 International Filing Date: 23.01.2017
IPC:
B23K 26/046 (2014.01) ,B23K 26/00 (2014.01) ,H01L 21/301 (2006.01) ,B23K 26/53 (2014.01)
[IPC code unknown for B23K 26/046]
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301
to subdivide a semiconductor body into separate parts, e.g. making partitions
[IPC code unknown for B23K 26/53]
Applicants:
浜松ホトニクス株式会社 HAMAMATSU PHOTONICS K.K. [JP/JP]; 静岡県浜松市東区市野町1126番地の1 1126-1, Ichino-cho, Higashi-ku, Hamamatsu-shi, Shizuoka 4358558, JP
Inventors:
奥間 惇治 OKUMA Junji; JP
Agent:
長谷川 芳樹 HASEGAWA Yoshiki; JP
黒木 義樹 KUROKI Yoshiki; JP
柴山 健一 SHIBAYAMA Kenichi; JP
Priority Data:
2016-01453028.01.2016JP
Title (EN) LASER MACHINING DEVICE AND LASER MACHINING METHOD
(FR) DISPOSITIF D'USINAGE LASER ET PROCÉDÉ D'USINAGE LASER
(JA) レーザ加工装置、及び、レーザ加工方法
Abstract:
(EN) Provided is a laser machining device for laser machining a workpiece by shining a laser beam on the workpiece along a machining line, said laser machining device being provided with a support stand, a laser beam source, a condensing unit, a moving unit, an actuator, a displacement sensor, a temperature sensor, and a control unit. The control unit calculates the drive amount of the condensing unit by the actuator on the basis of the displacement of the incidence plane measured by the displacement sensor and the temperature of the condensing unit detected by the temperature sensor, and when the moving unit relatively moves the condensing point, the control unit controls the actuator such that the condensing unit is driven in accordance with the drive amount.
(FR) L'invention concerne un dispositif d'usinage laser pour usiner au laser une pièce de travail par éclairage d'un faisceau laser sur la pièce de travail le long d'une ligne d'usinage, ledit dispositif d'usinage laser comprenant un pied de support, une source de faisceau laser, une unité de condensation, une unité de déplacement, un actionneur, un capteur de déplacement, un capteur de température et une unité de commande. L'unité de commande calcule la quantité d'entraînement de l'unité de condensation par l'actionneur sur la base du déplacement du plan d'incidence mesuré par le capteur de déplacement et de la température de l'unité de condensation détectée par le capteur de température et, lorsque l'unité de déplacement déplace relativement le point de condensation, l'unité de commande commande l'actionneur de sorte que l'unité de condensation soit entraînée conformément à la quantité d'entraînement.
(JA) 加工予定ラインに沿って加工対象物にレーザ光を照射することにより、前記加工対象物のレーザ加工を行うレーザ加工装置であって、支持台と、レーザ光源と、集光ユニットと、移動部と、アクチュエータと、変位センサと、温度センサと、制御部と、を備える。制御部は、変位センサが測定した入射面の変位と、温度センサが検出した集光ユニットの温度と、に基づいて、アクチュエータによる集光ユニットの駆動量を算出すると共に、移動部が集光点を相対移動させているときに駆動量に応じて集光ユニットを駆動するようにアクチュエータを制御する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN206588483KR1020180104682CN108602158DE112017000556US20190039169