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1. (WO2017130888) STRUCTURE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/130888 International Application No.: PCT/JP2017/002074
Publication Date: 03.08.2017 International Filing Date: 23.01.2017
IPC:
H01L 21/027 (2006.01) ,B29C 33/38 (2006.01) ,B29C 59/02 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
027
Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
33
Moulds or cores; Details thereof or accessories therefor
38
characterised by the material or the manufacturing process
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
59
Surface shaping, e.g. embossing; Apparatus therefor
02
by mechanical means, e.g. pressing
Applicants:
綜研化学株式会社 SOKEN CHEMICAL & ENGINEERING CO., LTD. [JP/JP]; 東京都豊島区高田3丁目29番5号 29-5, Takada 3-chome, Toshima-ku, Tokyo 1718531, JP
Inventors:
宮澤 幸大 MIYAZAWA, Yukihiro; JP
坂田 郁美 SAKATA, Ikumi; JP
Agent:
SK特許業務法人 SK INTELLECTUAL PROPERTY LAW FIRM; 東京都渋谷区広尾3-12-40 広尾ビル4階 Hiroo-Building 4th Floor, 3-12-40, Hiroo, Shibuya-ku, Tokyo 1500012, JP
奥野 彰彦 OKUNO Akihiko; JP
伊藤 寛之 ITO Hiroyuki; JP
Priority Data:
2016-01284426.01.2016JP
Title (EN) STRUCTURE
(FR) STRUCTURE
(JA) 構造体
Abstract:
(EN) Provided is a structure having a fine pattern, in which there is less difference in height between regions having different heights in the fine pattern. According to the present invention, there is provided a structure having an elastic layer and a resin layer provided on the upper side of the elastic layer, wherein the resin layer is provided with a fine pattern on the surface on the opposite side from the elastic layer, the fine pattern is provided with a plurality of regions of different height, and the structure is provided with either of configurations (1) or (2): (1) the Young's modulus of the elastic layer is 1 GPa or less; (2) the Young's modulus of the elastic layer is less than the Young's modulus of a substrate supporting the elastic layer.
(FR) L'invention concerne une structure présentant un motif fin, dans laquelle il existe une plus faible différence de hauteur entre des zones ayant des hauteurs différentes dans le motif fin. Selon la présente invention, une structure est décrite qui comprend une couche élastique et une couche de résine disposée sur le côté supérieur de la couche élastique, la couche de résine étant pourvue d'un motif fin sur la surface située à l'opposé de la couche élastique, le motif fin comportant une pluralité de zones de hauteurs différentes, et la structure étant dotée de l'une ou l'autre des configurations (1) et (2) : (1) le module de Young de la couche élastique est inférieur ou égal à 1 GPa ; (2) le module de Young de la couche élastique est inférieur au module de Young d'un substrat supportant la couche élastique.
(JA) 微細パターンを有する構造体であって、微細パターンにおける高さが異なる領域の高さの差が小さい構造体を提供する。 本発明によれば、弾性層と、その上側に設けられた樹脂層を有する構造体であって、前記樹脂層は、前記弾性層の反対側の面に微細パターンを備え、前記微細パターンは、高さが異なる複数の領域を備え、以下の(1)又は(2)の構成を備える;(1)前記弾性層のヤング率が1GPa以下である(2)前記弾性層のヤング率が前記弾性層を支持する基材のヤング率よりも小さい構造体が提供される。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN108475622KR1020180105665