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1. (WO2017130886) IMAGING UNIT, IMAGING MODULE, AND ENDOSCOPE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/130886 International Application No.: PCT/JP2017/002064
Publication Date: 03.08.2017 International Filing Date: 23.01.2017
IPC:
H04N 5/225 (2006.01) ,A61B 1/04 (2006.01) ,G02B 23/24 (2006.01) ,H01L 27/14 (2006.01) ,H04N 5/369 (2011.01)
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
222
Studio circuitry; Studio devices; Studio equipment
225
Television cameras
A HUMAN NECESSITIES
61
MEDICAL OR VETERINARY SCIENCE; HYGIENE
B
DIAGNOSIS; SURGERY; IDENTIFICATION
1
Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
04
combined with photographic or television appliances
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
23
Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
24
Instruments for viewing the inside of hollow bodies, e.g. fibrescopes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14
including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
30
Transforming light or analogous information into electric information
335
using solid-state image sensors [SSIS]
369
SSIS architecture; Circuitry associated therewith
Applicants:
オリンパス株式会社 OLYMPUS CORPORATION [JP/JP]; 東京都八王子市石川町2951番地 2951, Ishikawa-machi, Hachioji-shi, Tokyo 1928507, JP
Inventors:
本原 寛幸 MOTOHARA, Hiroyuki; JP
草野 康弘 KUSANO, Yasuhiro; JP
Agent:
特許業務法人酒井国際特許事務所 SAKAI INTERNATIONAL PATENT OFFICE; 東京都千代田区霞が関3丁目8番1号 虎の門三井ビルディング Toranomon Mitsui Building, 8-1, Kasumigaseki 3-chome, Chiyoda-ku, Tokyo 1000013, JP
Priority Data:
2016-01433828.01.2016JP
Title (EN) IMAGING UNIT, IMAGING MODULE, AND ENDOSCOPE
(FR) UNITÉ D'IMAGERIE, MODULE D'IMAGERIE, ET SYSTÈME D'ENDOSCOPE
(JA) 撮像ユニット、撮像モジュールおよび内視鏡
Abstract:
(EN) Provided are an imaging unit, an imaging module, and an endoscope that are more compact and to which a plurality of electronic components can be easily and precisely mounted. An imaging unit 10 according to the present invention is characterized by comprising a semiconductor package 20; a circuit substrate 30 that has a main body section 31 on which a connection land is formed, and an attachment section 32 protruding from a back surface of the main body section 31 and having cable connection electrodes formed on at least two facing side surfaces among protruding side surfaces; electronic components 51, 52; and a plurality of cables 60a-60c, wherein, in the attachment section 32, a center plane a1 between the two side surfaces on which the cable connection electrodes are formed in a facing manner is shifted away from a center plane a2 and protrudes from the main body section 31, said center plane a2 being between side surfaces of the semiconductor package 20 that are parallel to the two side surfaces of the attachment section 32, and at least one side surface is perpendicular to the back surface of the main body section 31 and makes a stepped shape, and an electronic component mounting region R is located next to the attachment section 32 on the back surface of the main body section 31.
(FR) L'invention concerne une unité d'imagerie, un module d'imagerie, et un endoscope qui sont plus compacts et auxquels une pluralité de composants électroniques peut être assemblée simplement et avec précision. Une unité d’imagerie 10 selon la présente invention est caractérisée en ce qu’elle comprend un boîtier semi-conducteur 20 ; un substrat de circuit 30 comprenant une section de corps principal 31 sur laquelle est formée une plage de connexion, et une section de fixation 32 faisant saillie depuis une surface arrière de la section de corps principal 31 et ayant des électrodes de connexion de câble formées sur au moins deux surfaces latérales opposées parmi des surfaces latérales saillantes ; des composants électroniques 51, 52 ; et une pluralité de câbles 60a -60c. Dans la section de fixation 32, un plan médian a1 entre les deux surfaces latérales sur lesquelles les électrodes de connexion de câble sont formées de manière opposée est décalé par rapport à un plan central a2 et fait saillie à partir de la section de corps principal 31. Ledit plan médian a2 se trouve entre les surfaces latérales du boîtier semi-conducteur 20 qui sont parallèles aux deux surfaces latérales de la section de fixation 32, et au moins une surface latérale est perpendiculaire à la surface arrière de la section de corps principal 31 et présente une forme étagée, et une région de montage de composant électronique R est placée à côté de la section de fixation 32 sur la surface arrière de la section de corps principal 31.
(JA) 小型化を図りながら、複数の電子部品を簡易かつ精度よく実装可能な撮像ユニット、撮像モジュールおよび内視鏡を提供する。本発明における撮像ユニット10は、半導体パッケージ20と、接続ランドが形成された本体部31と、本体部31の裏面に突出し、突出する側面のうち少なくとも対向する2側面にケーブル接続電極が形成された取付け部32と、を有する回路基板30と、電子部品51、52と、複数のケーブル60a~60cと、を備え、取付け部31は、ケーブル接続電極が対向して形成された2側面の中心面a1が、半導体パッケージ20の取付け部32の2側面と平行な側面の中心面a2からシフトして本体部31から突出し、少なくとも1側面は本体部31の裏面と垂直、かつ階段状をなし、電子部品実装領域Rは、本体部31の裏面に取付け部32と並べて配置されることを特徴とする。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
US20180049628CN107710730EP3410690