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1. (WO2017130839) SENSOR CHIP AND SENSING SYSTEM
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/130839 International Application No.: PCT/JP2017/001794
Publication Date: 03.08.2017 International Filing Date: 19.01.2017
IPC:
G01N 21/64 (2006.01) ,B82Y 20/00 (2011.01) ,B82Y 30/00 (2011.01)
G PHYSICS
01
MEASURING; TESTING
N
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21
Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible, or ultra-violet light
62
Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
63
optically excited
64
Fluorescence; Phosphorescence
B PERFORMING OPERATIONS; TRANSPORTING
82
NANO-TECHNOLOGY
Y
SPECIFIC USES OR APPLICATIONS OF NANO-STRUCTURES; MEASUREMENT OR ANALYSIS OF NANO-STRUCTURES; MANUFACTURE  OR TREATMENT OF NANO-STRUCTURES
20
Nano-optics, e.g. quantum optics or photonic crystals
B PERFORMING OPERATIONS; TRANSPORTING
82
NANO-TECHNOLOGY
Y
SPECIFIC USES OR APPLICATIONS OF NANO-STRUCTURES; MEASUREMENT OR ANALYSIS OF NANO-STRUCTURES; MANUFACTURE  OR TREATMENT OF NANO-STRUCTURES
30
Nano-technology for materials or surface science, e.g. nano-composites
Applicants:
住友化学株式会社 SUMITOMO CHEMICAL COMPANY, LIMITED [JP/JP]; 東京都中央区新川二丁目27番1号 27-1, Shinkawa 2-chome, Chuo-ku, Tokyo 1048260, JP
Inventors:
福浦 知浩 FUKUURA, Tomohiro; JP
住田 佳代 SUMIDA, Kayo; JP
斉藤 幸一 SAITO, Koichi; JP
Agent:
特許業務法人深見特許事務所 FUKAMI PATENT OFFICE, P.C.; 大阪府大阪市北区中之島三丁目2番4号 中之島フェスティバルタワー・ウエスト Nakanoshima Festival Tower West, 2-4, Nakanoshima 3-chome, Kita-ku, Osaka-shi, Osaka 5300005, JP
Priority Data:
2016-01314927.01.2016JP
Title (EN) SENSOR CHIP AND SENSING SYSTEM
(FR) PUCE DE CAPTEUR ET SYSTÈME DE DÉTECTION
(JA) センサーチップ及びセンシングシステム
Abstract:
(EN) A sensor chip (1) is used for detecting a substance to be detected and is provided with: a substrate (10); a metal-based particle aggregate layer (20) formed on the substrate (10); a protective layer (30) for covering the metal-based particle aggregate layer (20); and a trapping layer (40) formed on the protective layer (30) and having a trapping substance that specifically binds to the substance to be detected. The metal-based particle aggregate layer (20) comprises a particle aggregate formed by 30 or more metal-based particles (200) disposed in a two-dimensional manner so as to be mutually separated. The metal-based particles (200) have an average particle diameter within the range of 200-1600 nm, an average height within the range of 55-500 nm, and an aspect ratio, which is defined by a ratio of the average particle diameter to the average height, within the range of 1-8.
(FR) L'invention concerne une puce de capteur (1) qui est utilisée pour détecter une substance à détecter et qui comprend : un substrat (10); une couche d'agrégat de particules à base de métal (20) formée sur le substrat (10); une couche protectrice (30) recouvrant la couche d'agrégat de particules à base de métal (20); et une couche de piégeage (40) formée sur la couche protectrice (30) et comprenant une substance de piégeage qui se lie spécifiquement à la substance à détecter. La couche d'agrégat de particules à base de métal (20) comprend un agrégat de particules formé par 30 particules métalliques (200) ou plus disposées de manière bidimensionnelle de façon à être mutuellement séparées. Les particules à base de métal (200) ont un diamètre moyen de particule dans la plage de 200 à 1600 nm, une hauteur moyenne dans la plage de 55 à 500 nm, et un rapport d'aspect, qui est défini par un rapport du diamètre moyen de particule sur la hauteur moyenne, compris dans la plage 1 à 8.
(JA) 被検出物質を検出するために用いられるセンサーチップ(1)であって、基板(10)と、基板(10)上に形成されてなる金属系粒子集合体層(20)と、金属系粒子集合体層(20)を覆う保護層(30)と、保護層(30)上に形成されてなり、被検出物質と特異的結合する捕捉物質を有する捕捉層(40)と、を備え、金属系粒子集合体層(20)は、30個以上の金属系粒子(200)が互いに離間して二次元的に配置されてなる粒子集合体からなり、金属系粒子(200)は、その平均粒径が200~1600nmの範囲内、平均高さが55~500nmの範囲内、前記平均高さに対する前記平均粒径の比で定義されるアスペクト比が1~8の範囲内にある。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)