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1. (WO2017130755) THERMALLY CONDUCTIVE SHEET, PRODUCTION METHOD FOR THERMALLY CONDUCTIVE SHEET, HEAT DISSIPATION MEMBER, AND SEMICONDUCTOR DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/130755 International Application No.: PCT/JP2017/001122
Publication Date: 03.08.2017 International Filing Date: 13.01.2017
Chapter 2 Demand Filed: 26.09.2017
IPC:
H01L 23/373 (2006.01) ,C08K 3/04 (2006.01) ,C08K 7/00 (2006.01) ,H01L 23/36 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373
Cooling facilitated by selection of materials for the device
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
02
Elements
04
Carbon
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
7
Use of ingredients characterised by shape
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
Applicants:
デクセリアルズ株式会社 DEXERIALS CORPORATION [JP/JP]; 東京都品川区大崎一丁目11番2号 ゲートシティ大崎イーストタワー8階 Gate City Osaki, East Tower 8th Floor, 11-2, Osaki 1-chome, Shinagawa-ku, Tokyo 1410032, JP
Inventors:
金谷 紘希 KANAYA, Hiroki; JP
野村 優 NOMURA, Yu; JP
内田 俊介 UCHIDA, Shunsuke; JP
内田 信一 UCHIDA, Shinichi; JP
荒巻 慶輔 ARAMAKI, Keisuke; JP
Agent:
廣田 浩一 HIROTA, Koichi; JP
流 良広 NAGARE, Yoshihiro; JP
松田 奈緒子 MATSUDA, Naoko; JP
山下 武志 YAMASHITA, Takeshi; JP
Priority Data:
2016-01266326.01.2016JP
Title (EN) THERMALLY CONDUCTIVE SHEET, PRODUCTION METHOD FOR THERMALLY CONDUCTIVE SHEET, HEAT DISSIPATION MEMBER, AND SEMICONDUCTOR DEVICE
(FR) FEUILLE THERMOCONDUCTRICE, PROCÉDÉ DE FABRICATION DE FEUILLE THERMOCONDUCTRICE, ÉLÉMENT DE DISSIPATION DE CHALEUR ET DISPOSITIF À SEMI-CONDUCTEUR
(JA) 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置
Abstract:
(EN) A thermally conductive sheet that contains a binder resin, carbon fiber, and a thermally conductive filler that is not said carbon fiber. The mass ratio (carbon fiber/binder resin) of the carbon fiber and the binder resin is less than 1.30. The thermally conductive filler content of the thermally conductive sheet is 48-70 volume%. The carbon fiber is oriented in the thickness direction of the thermally conductive sheet.
(FR) L'invention concerne une feuille thermoconductrice qui contient une résine liante, des fibres de carbone, et une charge thermoconductrice qui n'est pas ladite fibre de carbone. Le rapport massique (fibres de carbone/résine liante) des fibres de carbone et de la résine liante est inférieur à 1,30. La teneur en charge thermoconductrice de la feuille thermoconductrice est de 48 à 70 % en volume. Les fibres de carbone sont orientées dans la direction d'épaisseur de la feuille thermoconductrice.
(JA) バインダ樹脂と、炭素繊維と、前記炭素繊維以外の熱伝導性フィラーとを含有する熱伝導シートであって、 前記炭素繊維と、前記バインダ樹脂との質量比(炭素繊維/バインダ樹脂)が、1.30未満であり、 前記熱伝導性フィラーの含有量が、48体積%~70体積%であり、 前記炭素繊維が、前記熱伝導シートの厚み方向に配向している、 熱伝導シートである。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
KR1020180050392CN108463882US20190055443