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1. (WO2017130740) THERMALLY CONDUCTIVE SHEET, PRODUCTION METHOD FOR THERMALLY CONDUCTIVE SHEET, HEAT DISSIPATION MEMBER, AND SEMICONDUCTOR DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/130740 International Application No.: PCT/JP2017/001039
Publication Date: 03.08.2017 International Filing Date: 13.01.2017
Chapter 2 Demand Filed: 26.09.2017
IPC:
C08L 101/00 (2006.01) ,B29C 39/00 (2006.01) ,B29C 47/00 (2006.01) ,C08K 3/00 (2006.01) ,C08K 7/06 (2006.01) ,C08K 9/04 (2006.01) ,C08L 83/04 (2006.01) ,D04H 1/4242 (2012.01) ,H01L 23/36 (2006.01) ,H01L 23/373 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101
Compositions of unspecified macromolecular compounds
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
39
Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
47
Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
7
Use of ingredients characterised by shape
02
Fibres or whiskers
04
inorganic
06
Elements
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
9
Use of pretreated ingredients
04
Ingredients treated with organic substances
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
D TEXTILES; PAPER
04
BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
H
MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING
1
Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
40
from fleeces or layers composed of fibres without existing or potential cohesive properties
42
characterised by the use of certain kinds of fibres insofar as this use has no preponderant influence on the consolidation of the fleece
4209
Inorganic fibres
4242
Carbon fibres
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373
Cooling facilitated by selection of materials for the device
Applicants:
デクセリアルズ株式会社 DEXERIALS CORPORATION [JP/JP]; 東京都品川区大崎一丁目11番2号 ゲートシティ大崎イーストタワー8階 Gate City Osaki, East Tower 8th Floor, 11-2, Osaki 1-chome, Shinagawa-ku, Tokyo 1410032, JP
Inventors:
金谷 紘希 KANAYA, Hiroki; JP
内田 信一 UCHIDA, Shinichi; JP
内田 俊介 UCHIDA, Shunsuke; JP
リシャブ グプタ RISHABH, Gupta; JP
荒巻 慶輔 ARAMAKI, Keisuke; JP
Agent:
廣田 浩一 HIROTA, Koichi; JP
流 良広 NAGARE, Yoshihiro; JP
松田 奈緒子 MATSUDA, Naoko; JP
山下 武志 YAMASHITA, Takeshi; JP
Priority Data:
2016-01267226.01.2016JP
2016-25426327.12.2016JP
Title (EN) THERMALLY CONDUCTIVE SHEET, PRODUCTION METHOD FOR THERMALLY CONDUCTIVE SHEET, HEAT DISSIPATION MEMBER, AND SEMICONDUCTOR DEVICE
(FR) FEUILLE THERMIQUEMENT CONDUCTRICE, PROCÉDÉ DE FABRICATION DE FEUILLE THERMIQUEMENT CONDUCTRICE, ÉLÉMENT DE DISSIPATION DE CHALEUR, ET DISPOSITIF SEMI-CONDUCTEUR
(JA) 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置
Abstract:
(EN) A thermally conductive sheet that contains a binder resin, insulated coated carbon fiber, and a thermally conductive filler that is not said insulated coated carbon fiber. The mass ratio (insulated coated carbon fiber/binder resin) of the insulated coated carbon fiber and the binder resin is less than 1.30. The insulated coated carbon fiber contains carbon fiber and, on at least one portion of the surface of the carbon fiber, a coating film that comprises a cured product of a polymerizable material.
(FR) La présente invention concerne une feuille thermiquement conductrice qui contient une résine liante, une fibre de carbone revêtue isolée, et une charge thermiquement conductrice qui n’est pas ladite fibre de carbone revêtue isolée. Le rapport en masse (de la fibre de carbone revêtue isolée/la résine liante) de la fibre de carbone revêtue isolée et de la résine liante est inférieur à 1,30. La fibre de carbone revêtue isolée contient une fibre de carbone et, au moins sur une partie de la surface de la fibre de carbone, un film de revêtement qui comprend un produit durci d’un matériau polymérisable.
(JA) バインダ樹脂と、絶縁被覆炭素繊維と、前記絶縁被覆炭素繊維以外の熱伝導性フィラーとを含有し、 前記絶縁被覆炭素繊維と、前記バインダ樹脂との質量比(絶縁被覆炭素繊維/バインダ樹脂)が、1.30未満であり、 前記絶縁被覆炭素繊維が、炭素繊維と、前記炭素繊維の表面の少なくとも一部に重合性材料の硬化物からなる皮膜とを含有する熱伝導シートである。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
KR1020180086432CN108463511EP3409728US20190035712