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1. (WO2017130596) SEMICONDUCTOR LIGHT EMITTING DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/130596 International Application No.: PCT/JP2016/087435
Publication Date: 03.08.2017 International Filing Date: 15.12.2016
IPC:
H01S 5/022 (2006.01) ,H01L 23/28 (2006.01) ,H01L 23/40 (2006.01) ,H01L 33/50 (2010.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
S
DEVICES USING STIMULATED EMISSION
5
Semiconductor lasers
02
Structural details or components not essential to laser action
022
Mountings; Housings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
40
Mountings or securing means for detachable cooling or heating arrangements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
50
Wavelength conversion elements
Applicants:
ソニー株式会社 SONY CORPORATION [JP/JP]; 東京都港区港南1丁目7番1号 1-7-1, Konan, Minato-ku, Tokyo 1080075, JP
Inventors:
川西 秀和 KAWANISHI, Hidekazu; JP
村山 雅洋 MURAYAMA, Masahiro; JP
Agent:
特許業務法人つばさ国際特許事務所 TSUBASA PATENT PROFESSIONAL CORPORATION; 東京都新宿区新宿1丁目15番9号さわだビル3階 3F, Sawada Building, 15-9, Shinjuku 1-chome, Shinjuku-ku, Tokyo 1600022, JP
Priority Data:
2016-01461028.01.2016JP
Title (EN) SEMICONDUCTOR LIGHT EMITTING DEVICE
(FR) DISPOSITIF ÉLECTROLUMINESCENT À SEMI-CONDUCTEURS
(JA) 半導体発光装置
Abstract:
(EN) A semiconductor light emitting device which is provided with: a substrate; a semiconductor light emitting element which is provided on the substrate and emits light in a direction that is generally parallel to the main surface of the substrate; a wavelength conversion element which is arranged on the light emission side of the semiconductor light emitting element, absorbs some of the light emitted from the semiconductor light emitting element, and emits light that has a wavelength different from the wavelength of the absorbed light; and a holding member which is provided on the substrate and holds the wavelength conversion element.
(FR) L'invention concerne un dispositif électroluminescent à semi-conducteurs qui est doté : d'un substrat ; d'un élément électroluminescent à semi-conducteurs disposé sur le substrat et émettant de la lumière dans une direction généralement parallèle à la surface principale du substrat ; d'un élément de conversion de longueur d'onde disposé du côté émission de lumière de l'élément électroluminescent à semi-conducteurs, absorbant une partie de la lumière émise par l'élément électroluminescent à semi-conducteurs, et émettant une lumière ayant une longueur d'onde différente de la longueur d'onde de la lumière absorbée ; et d'un élément de support disposé sur le substrat et supportant l'élément de conversion de longueur d'onde.
(JA) 基板と、前記基板上に設けられると共に、前記基板の主面と略平行な方向に沿って光を出射する半導体発光素子と、前記半導体発光素子の光出射側に配置されると共に、前記半導体発光素子から出射された光の一部を吸収し、吸収した光とは異なる波長の光を発する波長変換素子と、前記基板上に設けられると共に、前記波長変換素子を保持する保持部材とを備えた半導体発光装置。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN108604765US20190020174