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1. WO2017130471 - MANUFACTURING METHOD OF COPPER MEMBER BONDED BODY

Publication Number WO/2017/130471
Publication Date 03.08.2017
International Application No. PCT/JP2016/080201
International Filing Date 12.10.2016
IPC
B22F 7/08 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
7Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting
06of composite workpieces or articles from parts, e.g. to form tipped tools
08with one or more parts not made from powder
C22C 1/08 2006.1
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
1Making non-ferrous alloys
08Alloys with open or closed pores
CPC
B22F 2201/01
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER
2201Treatment under specific atmosphere
01Reducing atmosphere
B22F 2301/10
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER
2301Metallic composition of the powder or its coating
10Copper
B22F 2302/25
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER
2302Metal Compound, non-Metallic compound or non-metal composition of the powder or its coating
25Oxide
B22F 2998/10
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER
2998Supplementary information concerning processes or compositions relating to powder metallurgy
10Processes characterised by the sequence of their steps
B22F 7/002
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER
7Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting ; wherein at least one part is obtained by sintering or compression
002of porous nature
B22F 7/064
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER
7Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting ; wherein at least one part is obtained by sintering or compression
06of composite workpieces or articles from parts, e.g. to form tipped tools
062involving the connection or repairing of preformed parts
064using an intermediate powder layer
Applicants
  • 三菱マテリアル株式会社 MITSUBISHI MATERIALS CORPORATION [JP]/[JP]
Inventors
  • 加藤 純 KATO Jun
  • 喜多 晃一 KITA Koichi
Agents
  • 志賀 正武 SHIGA Masatake
  • 寺本 光生 TERAMOTO Mitsuo
  • 松沼 泰史 MATSUNUMA Yasushi
  • 細川 文広 HOSOKAWA Fumihiro
  • 大浪 一徳 ONAMI Kazunori
Priority Data
2016-01368327.01.2016JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) MANUFACTURING METHOD OF COPPER MEMBER BONDED BODY
(FR) PROCÉDÉ DE FABRICATION DE CORPS COLLÉ D'ÉLÉMENTS EN CUIVRE
(JA) 銅部材接合体の製造方法
Abstract
(EN) In this manufacturing method of a copper member bonded body formed by bonding a first copper member and a second copper member, the first copper member and the second copper member are formed from copper or a copper alloy, and the first copper member and/or the second copper member includes a copper porous body formed from copper or a copper alloy. This manufacturing method involves a bonding material arrangement step S01 in which a bonding material is arranged between the first copper member and the second copper member, and a reducing and sintering step S02 in which the first copper member, the second copper member and the bonding material are heated and held in a reducing atmosphere within the range of 600°C-1050°C. The aforementioned bonding material contains a copper oxide, or a mixture of metallic copper and a copper oxide, having a copper to oxygen molar ratio in the range Cu:O = 1:0.3-1.0, and includes a copper oxide powder and/or a metallic copper powder. With respect to the average pore diameter Dp of the copper porous body, the average particle diameter D of the copper oxide powder or the metallic copper powder is in the range 0.05×Dp ≦ D ≦ 2×Dp. Through the aforementioned reducing and sintering, a bonding layer comprising a metallic copper is formed between the first copper member and the second copper member.
(FR) L'invention concerne un procédé de fabrication d'un corps collé d'éléments en cuivre formé par collage d'un premier élément en cuivre et d'un second élément en cuivre, le premier élément en cuivre et le second élément en cuivre étant constitués de cuivre ou d'un alliage de cuivre et le premier élément en cuivre et/ou le second élément en cuivre comprenant un corps poreux en cuivre constitué de cuivre ou d'un alliage de cuivre. Ce procédé de fabrication comprend une étape de disposition de matériau de collage (S01) dans laquelle un matériau de collage est disposé entre le premier élément en cuivre et le second élément en cuivre et une étape de réduction et de frittage (S02) dans laquelle le premier élément en cuivre, le second élément en cuivre et le matériau de collage sont chauffés et maintenus dans une atmosphère réductrice dans la plage de 600 °C à 1050 °C. Le matériau de collage contient un oxyde de cuivre ou un mélange de cuivre métallique et d'un oxyde de cuivre ayant un rapport molaire du cuivre à l'oxygène Cu:O dans la plage de 1:0,3 à 1:1,0 et comprend une poudre d'oxyde de cuivre et/ou une poudre de cuivre métallique. Par rapport au diamètre moyen des pores Dp du corps poreux en cuivre, le diamètre moyen des particules D de la poudre d'oxyde de cuivre ou de la poudre de cuivre métallique est dans la plage de 0,05 × Dp ≦ D ≦ 2 × Dp. Par la réduction et le frittage susmentionnés, une couche de collage comprenant un cuivre métallique est formée entre le premier élément en cuivre et le second élément en cuivre.
(JA) 第1の銅部材と第2の銅部材が接合された銅部材接合体の製造方法であって、 前記第1の銅部材および前記第2の銅部材は銅又は銅合金からなり、前記第1の銅部材および第2の銅部材の少なくとも1つは、銅又は銅合金からなる銅多孔質体を含む。この製造方法は、前記第1の銅部材および前記第2の銅部材の間に、接合材を配置する接合材配置工程S01と、前記第1の銅部材、前記第2の銅部材、および前記接合材を、還元雰囲気下において600℃以上1050℃以下の範囲内で加熱保持する還元焼結工程S02とを有する。前記接合材は、銅と酸素とのモル比率がCu:O=1:0.3~1.0の範囲内とされた銅酸化物又は金属銅と銅酸化物の混合物を含有し、かつ、銅酸化物粉又は金属銅粉の少なくとも一方を有する。前記銅酸化物粉又は前記金属銅粉の平均粒径Dは、前記銅多孔質体の平均細孔直径Dpに対して、0.05×Dp≦D≦2×Dpの範囲内である。前記還元焼結により、前記第1の銅部材および前記第2の銅部材の間に、金属銅からなる接合層を形成する。
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