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1. (WO2017130371) IMAGE PICKUP DEVICE AND ENDOSCOPE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/130371 International Application No.: PCT/JP2016/052619
Publication Date: 03.08.2017 International Filing Date: 29.01.2016
IPC:
H01L 27/14 (2006.01) ,A61B 1/04 (2006.01) ,H04N 5/369 (2011.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14
including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
A HUMAN NECESSITIES
61
MEDICAL OR VETERINARY SCIENCE; HYGIENE
B
DIAGNOSIS; SURGERY; IDENTIFICATION
1
Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
04
combined with photographic or television appliances
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
30
Transforming light or analogous information into electric information
335
using solid-state image sensors [SSIS]
369
SSIS architecture; Circuitry associated therewith
Applicants:
オリンパス株式会社 OLYMPUS CORPORATION [JP/JP]; 東京都渋谷区幡ヶ谷二丁目43番2号 43-2, Hatagaya 2-chome, Shibuya-ku, Tokyo 1510072, JP
Inventors:
岡村 誠一郎 OKAMURA Seiichiro; JP
Agent:
伊藤 進 ITOH Susumu; JP
Priority Data:
Title (EN) IMAGE PICKUP DEVICE AND ENDOSCOPE
(FR) DISPOSITIF D'IMAGERIE, ET ENDOSCOPE
(JA) 撮像装置および内視鏡
Abstract:
(EN) An image pickup device 1 is provided with: an image sensor chip 12 which is provided with a light receiving section that receives light of an image of a subject; a driving circuit chip 13 laminated to the image sensor chip 12; and a thin film capacitor chip 14 laminated to the driving circuit chip 13. The image pickup device is also provided with a camera assembly 10 wherein the image sensor chip 12, the driving circuit chip 13, and the thin film capacitor chip 14 are laminated and bonded to each other.
(FR) Le dispositif d'imagerie (1) de l'invention est équipé : d'une puce de détecteur d'image (12) qui est équipée d'une partie réceptrice de lumière recevant une image sujet; d'une puce de circuit pour excitation (13) qui est stratifiée sur la puce de détecteur d'image (12); d'une puce de condensateur à film mince (14) qui est stratifiée sur la puce de circuit pour excitation (13). En outre, le dispositif d'imagerie (1) est muni d'un ensemble appareil photographique (10) dans lequel la puce de détecteur d'image (12), la puce de circuit pour excitation (13) et la puce de condensateur à film mince (14) sont stratifiées et liées.
(JA) 撮像装置1は、被写体像を受光する受光部を備えたイメージセンサチップ12と、イメージセンサチップ12に積層された駆動用回路チップ13と、駆動用回路チップ13に積層された薄膜コンデンサチップ14と、を備え、イメージセンサチップ12、駆動用回路チップ13および薄膜コンデンサチップ14を積層して接合したカメラアッセンブリ10と、を具備する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)