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1. (WO2017130139) PACKAGING GLASS WITH HIERARCHICALLY NANOSTRUCTURED SURFACE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/130139 International Application No.: PCT/IB2017/050426
Publication Date: 03.08.2017 International Filing Date: 26.01.2017
IPC:
H01L 31/0236 (2006.01) ,H02S 40/10 (2014.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31
Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
Details
0236
Special surface textures
[IPC code unknown for H02S 40/10]
Applicants:
KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY [SA/SA]; 4700 King Abdullah University of Science and Technology Thuwal, 23955-6900, SA
Inventors:
HE, Jr-Hau; SA
FU, Hui-Chun; SA
Priority Data:
62/287,17226.01.2016US
Title (EN) PACKAGING GLASS WITH HIERARCHICALLY NANOSTRUCTURED SURFACE
(FR) VERRE D'EMBALLAGE À SURFACE HIÉRARCHIQUEMENT NANOSTRUCTURÉE
Abstract:
(EN) An optical device includes an active region and packaging glass located on top of the active region. A top surface of the packaging glass includes hierarchical nanostructures comprised of honeycombed nanowalls (HNWs) and nanorod (NR) structures extending from the HNWs.
(FR) Dispositif optique comprenant une région active et du verre d'emballage situé sur la région active. Une surface supérieure du verre d'emballage comprend des nanostructures hiérarchiques composées de nanoparois en nid-d'abeilles (HNW) et de structures à nanotiges (NR) s'étendant depuis les HNW.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
US20190044004