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1. (WO2017129687) ASSEMBLY COMPRISING HYBRID INTERCONNECTING MEANS INCLUDING INTERMEDIATE INTERCONNECTING ELEMENTS AND SINTERED METAL JOINTS, AND MANUFACTURING PROCESS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/129687 International Application No.: PCT/EP2017/051667
Publication Date: 03.08.2017 International Filing Date: 26.01.2017
IPC:
H01L 21/60 (2006.01) ,H01L 23/485 (2006.01) ,H01L 23/498 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
482
consisting of lead-in layers inseparably applied to the semiconductor body
485
consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488
consisting of soldered or bonded constructions
498
Leads on insulating substrates
Applicants:
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES [FR/FR]; 25 rue Leblanc - Bâtiment "Le Ponant D" 75015 Paris, FR
Inventors:
KHAZAKA, Rabih; FR
THOLLIN, Benoît; FR
Agent:
ESSELIN, Sophie; FR
LUCAS, Laurent; FR
Priority Data:
165058326.01.2016FR
Title (EN) ASSEMBLY COMPRISING HYBRID INTERCONNECTING MEANS INCLUDING INTERMEDIATE INTERCONNECTING ELEMENTS AND SINTERED METAL JOINTS, AND MANUFACTURING PROCESS
(FR) ASSEMBLAGE COMPRENANT DES MOYENS D'INTERCONNEXION MIXTES COMPORTANT DES ELEMENTS INTERMEDIAIRES D'INTERCONNEXION ET DES JOINTS FRITTES METALLIQUES ET PROCEDE DE FABRICATION
Abstract:
(EN) The invention relates to an assembly comprising: - at least one first element (100) comprising at least one first electrically connecting contact pad (12); - at least one second element (200) comprising at least one second electrically connecting contact pad (21); and electrically and mechanically interconnecting means, characterised in that said electrically and mechanically interconnecting means comprise at least: - at least one first metal intermediate interconnecting element (13), on the surface of at least the first electrically connecting contact pad; - at least one sintered joint of metal microparticles or nanoparticles, which joint is stacked on top of the first metal intermediate interconnecting element; - the melting point of the first metal intermediate interconnecting element being above the sintering temperature of the metal microparticles or nanoparticles. The invention further relates to a process for manufacturing an assembly according to the invention.
(FR) L'invention a pour objet un assemblage comprenant : - au moins un premier élément (100) comprenant au moins un premier plot de connexion électrique (12); - au moins un second élément (200) comprenant au moins un second plot de connexion électrique (21); - des moyens d'interconnexion électrique et mécanique, caractérisé en ce que lesdits moyens d'interconnexion électrique et mécanique comprennent au moins : - au moins un premier élément intermédiaire métallique d'interconnexion (13), à la surface d'au moins le premier plot de connexion électrique; - au moins un joint fritté de microparticules ou de nanoparticules métalliques empilé avec ledit premier élément intermédiaire métallique d'interconnexion; - la température de fusion dudit premier élément intermédiaire métallique d'interconnexion étant supérieure à la température de frittage desdites microparticules ou de nanoparticules métalliques. L'invention a aussi pour objet un procédé de fabrication d'un assemblage de l'invention.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: French (FR)
Filing Language: French (FR)
Also published as:
EP3408863US20180374813