Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO2017129171) METHOD AND APPARATUS FOR REMOVAL OF A MICROCHIP FROM A WAFER AND APPLICATION OF THE MICROCHIP TO A SUBSTRATE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/129171 International Application No.: PCT/DE2017/100035
Publication Date: 03.08.2017 International Filing Date: 23.01.2017
IPC:
H01L 21/683 (2006.01) ,H01L 21/67 (2006.01) ,H05K 13/04 (2006.01) ,H01L 23/00 (2006.01) ,H01L 21/677 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13
Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
04
Mounting of components
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677
for conveying, e.g. between different work stations
Applicants:
JENOPTIK OPTICAL SYSTEMS GMBH [DE/DE]; Göschwitzer Strasse 25 07745 Jena, DE
Inventors:
PANITZ, Meik; DE
Agent:
SCHALLER, Renate; DE
OEHMKE, Volker; DE
FREITAG, Joachim; DE
Priority Data:
10 2016 001 322.229.01.2016DE
Title (DE) VERFAHREN UND VORRICHTUNG ZUM HERAUSLÖSEN EINES MIKRO-CHIPS AUS EINEM WAFER UND AUFBRINGEN DES MIKRO-CHIPS AUF EIN SUBSTRAT
(EN) METHOD AND APPARATUS FOR REMOVAL OF A MICROCHIP FROM A WAFER AND APPLICATION OF THE MICROCHIP TO A SUBSTRATE
(FR) PROCÉDÉ ET DISPOSITIF POUR SÉPARER UNE MICRO-PUCE D’UNE TRANCHE ET APPLIQUER LA MICRO-PUCE SUR UN SUBSTRAT
Abstract:
(DE) Verfahren und Vorrichtung zum Abtrennen eines Mikro-Chips (2) aus einem Wafers (1) und Aufbringen des Mikro-Chips (2) auf ein Substrat (6), bei dem der Mikro-Chip (2) während des Herauslösens an das freie Ende (5.1.1) einer Spitze (5.1) angesprengt wird und so während des Transportes zum Substrat (6) durch Adhäsionskraft an der Spitze (5.1) haftet. Als Vorrichtung kann vorteilhaft ein Koordinatenmessgerät verwendet werden.
(EN) The invention relates to a method and to an apparatus for separating a microchip (2) from a wafer (1) and applying the microchip (2) to a substrate (6), wherein during the removal the microchip (2) is wrung onto the free end (5.1.1) of a tip (5.1) and thus adheres to the tip (5.1) by adhesion force during transport to the substrate (6). A co-ordinate measuring assembly may advantageously be used as the apparatus.
(FR) Procédé et dispositif pour séparer une micro-puce (2) d’une tranche (1) et appliquer la micro-puce (2) sur un substrat (6), la micro-puce (2), lors de la séparation, étant accolée à l’extrémité libre (5.1.1) d’une pointe (5.1) et adhérant ainsi à la pointe (5.1) par force d'adhérence au cours du transport vers le substrat (6). Avantageusement, le dispositif utilisé peut être une machine à mesurer tridimensionnelle.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)
Also published as:
EP3234992CN107251212KR1020170132731JP6301565JP2018515905US20190122908