PATENTSCOPE will be unavailable a few hours for maintenance reason on Tuesday 19.11.2019 at 4:00 PM CET
Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO2017128475) PACKAGING ASSEMBLY AND PACKAGING METHOD THEREOF
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/128475 International Application No.: PCT/CN2016/074641
Publication Date: 03.08.2017 International Filing Date: 26.02.2016
IPC:
H01L 51/56 (2006.01) ,H01L 51/52 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56
Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52
Details of devices
Applicants:
深圳市华星光电技术有限公司 SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. [CN/CN]; 中国广东省深圳市 光明新区塘明大道9-2号 NO.9-2, Tangming Rd, Guangming New District Shenzhen, Guangdong 518132, CN
Inventors:
刘亚伟 LIU, Yawei; CN
吕伯彦 LV, Boyan; CN
Agent:
深圳市威世博知识产权代理事务所(普通合伙) CHINA WISPRO INTELLECTUAL PROPERTY LLP.; 中国广东省深圳市 南山区高新区粤兴三道8号中国地质大学产学研基地中地大楼A806 Room A806 Zhongdi Building, China University of Geosciences Base No.8 Yuexing 3rd Road, High-Tech Industrial Estate, Nanshan District Shenzhen, Guangdong 518057, CN
Priority Data:
201610064236.029.01.2016CN
Title (EN) PACKAGING ASSEMBLY AND PACKAGING METHOD THEREOF
(FR) ÉLÉMENT DE CONDITIONNEMENT ET PROCÉDÉ DE CONDITIONNEMENT CORRESPONDANT
(ZH) 封装组件及其封装方法
Abstract:
(EN) A packaging assembly and a packaging method thereof. The method comprises the steps of: coating a glass glue (40) in a circle on a glass coverboard (20); coating an outer frame glue in a circle at an outer side of the glass glue, wherein the outer frame glue and the glass glue are separated by a space; adding, at an inner side of the glass glue, a filler material (30); adhering a glass substrate to the glass coverboard; and shining a laser on the glass glue to adhere the glass substrate (10) to the glass coverboard by means of the glass glue. The method can prevent oxygen or vapor from entering, increasing the service life of components in the glass glue.
(FR) La présente invention porte sur un élément de conditionnement et un procédé de conditionnement correspondant. Le procédé comprend les étapes consistant à : revêtir une colle de verre (40) en cercle sur une dernière couche de verre (20) ; appliquer une colle de cadre externe en cercle au niveau d'un côté extérieur de la colle de verre, la colle de cadre externe et la colle de verre étant séparées par un espace ; ajouter, au niveau d'un côté intérieur de la colle de verre, une matière de charge (30) ; faire un adhérer un substrat en verre sur la dernière couche de verre ; et projeter un faisceau laser sur la colle de verre pour faire adhérer le substrat en verre (10) à la dernière couche de verre au moyen de la colle de verre. Ce procédé permet d'empêcher l'oxygène ou de la vapeur d'entrer, augmentant la durée de vie de constituants dans la colle de verre.
(ZH) 一种封装组件及其封装方法,其包括步骤:在玻璃盖板(20)上涂布一圈玻璃胶(40);在玻璃胶外侧涂布一圈外框胶,其中,外框胶与玻璃胶间隔涂布;在玻璃胶内侧加入填充材料(30);将玻璃基板贴合于玻璃盖板;使用激光照射玻璃胶,以使得通过玻璃胶将玻璃基板(10)焊接于玻璃盖板。该方法可避免氧气或水汽渗入,提高玻璃胶内零件的寿命。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)
Also published as:
US20180205034