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1. (WO2017112843) CORROSION RESISTANT COATING FOR SEMICONDUCTOR PROCESS EQUIPMENT
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/112843 International Application No.: PCT/US2016/068202
Publication Date: 29.06.2017 International Filing Date: 22.12.2016
IPC:
H01L 21/56 (2006.01) ,H01L 21/02 (2006.01) ,H01L 21/288 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56
Encapsulations, e.g. encapsulating layers, coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
28
Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/268158
283
Deposition of conductive or insulating materials for electrodes
288
from a liquid, e.g. electrolytic deposition
Applicants:
APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue Santa Clara, California 95054, US
Inventors:
PAREEK, Yogita; IN
BAJAJ, Geetika; IN
GORADIA, Prerna; IN
KADAM, Ankur; IN
THAKUR, Bipin; IN
Agent:
TABOADA, Alan; US
MOSER, JR., Raymond R.; US
LINARDAKIS, Leonard P.; US
Priority Data:
4236/DEL/201522.12.2015IN
Title (EN) CORROSION RESISTANT COATING FOR SEMICONDUCTOR PROCESS EQUIPMENT
(FR) REVÊTEMENT RÉSISTANT À LA CORROSION POUR DES ÉQUIPEMENTS DE TRAITEMENT DE SEMI-CONDUCTEURS
Abstract:
(EN) A corrosion resistant coating for semiconductor process equipment and methods of making corrosion resistant coatings for semiconductor process equipment are provided herein. In some embodiments, a method of treating a semiconductor processing chamber component, includes: anodizing a semiconductor processing chamber component comprising an aluminum containing body in an anodizing solution comprising a neutral electrolyte and a resistive material to form a corrosion resistant coating atop the aluminum containing body. In some embodiments, a method of treating a semiconductor processing chamber component, includes: anodizing a semiconductor processing chamber component comprising an aluminum containing body in a neutral electrolyte solution to form an aluminum oxide layer on a surface of the aluminum containing body; and dipping the anodized semiconductor processing chamber component in a resistive material solution to form a resistive material layer atop the aluminum oxide layer.
(FR) La présente invention concerne un revêtement résistant à la corrosion pour des équipements de traitement de semi-conducteurs et des procédés de fabrication de revêtements résistants à la corrosion pour des équipements de traitement de semi-conducteurs. Dans certains modes de réalisation, un procédé de traitement d'un composant de chambre de traitement de semi-conducteurs comprend les étapes suivantes : anodiser un composant de chambre de traitement de semi-conducteurs comprenant un corps contenant de l'aluminium dans une solution d'anodisation comprenant un électrolyte neutre et un matériau résistif pour former un revêtement résistant à la corrosion au-dessus du corps contenant de l'aluminium. Dans certains modes de réalisation, un procédé de traitement d'un composant de chambre de traitement de semi-conducteurs comprend les étapes suivantes : anodiser un composant de chambre de traitement de semi-conducteurs comprenant un corps contenant de l'aluminium dans une solution d'électrolyte neutre pour former une couche d'oxyde d'aluminium sur une surface du corps contenant de l'aluminium ; et tremper le composant de chambre de traitement de semi-conducteurs anodisé dans une solution de matériau résistif pour former une couche de matériau résistif au-dessus de la couche d'oxyde d'aluminium.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
CN108431934KR1020180087457US20180374706