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1. (WO2017112350) NON-RECTANGULAR ELECTRONIC DEVICE COMPONENTS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/112350 International Application No.: PCT/US2016/063799
Publication Date: 29.06.2017 International Filing Date: 26.11.2016
IPC:
H01L 21/02 (2006.01) ,H01L 23/13 (2006.01) ,H01L 29/06 (2006.01) ,H05K 13/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
13
characterised by the shape
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
29
Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier; Capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof
02
Semiconductor bodies
06
characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13
Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
Applicants:
INTEL CORPORATION [US/US]; 2200 Mission College Boulevard Santa Clara, California 95054, US
Inventors:
MALATKAR, Pramod; US
AGRAHARAM, Sairam; US
LIFF, Shawna; US
Agent:
OSBORNE, David W.; US
Priority Data:
14/757,83526.12.2015US
Title (EN) NON-RECTANGULAR ELECTRONIC DEVICE COMPONENTS
(FR) COMPOSANTS DE DISPOSITIF ÉLECTRONIQUE NON RECTANGULAIRE
Abstract:
(EN) Electronic device shape configuration technology is disclosed. In an example, an electronic device substrate is provided that can comprise a top surface, and a bottom surface opposing the top surface. The top surface and/or the bottom surface can have a non-rectangular shaped perimeter. An electronic device die is also provided that can comprise a top surface, and a bottom surface opposing the top surface. The top surface and/or the bottom surface can have a non-rectangular shaped perimeter. In addition, an electronic device package is provided that can comprise a substrate having a top surface configured to receive a die and a bottom surface opposing the top surface. The package can also include a die having a top surface and a bottom surface opposing the top surface. The die can be coupled to the top surface of the substrate. The top surface and/or the bottom surface of either the substrate, or the die, or both can have a non-rectangular shaped perimeter.
(FR) L'invention concerne une technologie de configuration de forme de dispositif électronique. Dans un exemple, un substrat de dispositif électronique peut comprendre une surface supérieure, et une surface inférieure opposée à la surface supérieure. La surface supérieure et/ou la surface inférieure peuvent présenter un périmètre de forme non rectangulaire. L'invention concerne également une puce de dispositif électronique qui peut comprendre une surface supérieure, et une surface inférieure opposée à la surface supérieure. La surface supérieure et/ou la surface inférieure peuvent présenter un périmètre de forme non rectangulaire. En outre, un boîtier de dispositif électronique peut comprendre un substrat présentant une surface supérieure conçue de manière à recevoir une puce et une surface inférieure opposée à la surface supérieure. Le boîtier peut également comprendre une puce présentant une surface supérieure et une surface inférieure opposée à la surface supérieure. La puce peut être couplée à la surface supérieure du substrat. La surface supérieure et/ou la surface inférieure du substrat, de la puce ou des deux peuvent présenter un périmètre de forme non rectangulaire.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
DE112016006068