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1. (WO2017112134) INTEGRATED CIRCUIT PACKAGES WITH TEMPERATURE SENSOR TRACES
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/112134 International Application No.: PCT/US2016/062117
Publication Date: 29.06.2017 International Filing Date: 16.11.2016
IPC:
H01L 23/34 (2006.01) ,H01L 23/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
Applicants:
INTEL CORPORATION [US/US]; 2200 Mission College Boulevard Santa Clara, California 95054-1549, US
Inventors:
FERGUSON, Shelby; US
YEE, Rashelle; US
AOKI, Russell S.; US
HUI, Michael; US
CARSTENS, Jonathon Robert; US
JASNIEWSKI, Joseph J.; US
Agent:
ZAGER, Laura A.; US
Priority Data:
14/975,93821.12.2015US
Title (EN) INTEGRATED CIRCUIT PACKAGES WITH TEMPERATURE SENSOR TRACES
(FR) BOÎTIERS DE CIRCUIT INTÉGRÉ COMPORTANT DES TRACÉS DE CAPTEUR DE TEMPÉRATURE
Abstract:
(EN) Disclosed herein are integrated circuit (IC) packages with temperature sensor traces, and related systems, devices, and methods. In some embodiments, an IC package may include a package substrate and an IC die disposed on the package substrate, wherein the package substrate includes a temperature sensor trace, and an electrical resistance of the temperature sensor trace is representative of an equivalent temperature of the temperature sensor trace.
(FR) L'invention concerne des boîtiers de circuit intégré (CI) comportant des tracés de capteur de température, et concerne également des systèmes, des dispositifs et des procédés associés. Dans certains modes de réalisation, un boîtier de CI peut comprendre un substrat de boîtier et une puce de CI placée sur le substrat de boîtier, le substrat de boîtier comprenant un tracé de capteur de température, et une résistance électrique du tracé de capteur de température étant représentative d'une température équivalente du tracé de capteur de température.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)