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1. (WO2017112128) FLIP-CHIP PACKAGE WITH THERMAL DISSIPATION LAYER
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/112128 International Application No.: PCT/US2016/061919
Publication Date: 29.06.2017 International Filing Date: 14.11.2016
IPC:
H01L 23/367 (2006.01) ,H01L 23/373 (2006.01) ,H01L 23/31 (2006.01) ,H01L 23/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
367
Cooling facilitated by shape of device
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373
Cooling facilitated by selection of materials for the device
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
31
characterised by the arrangement
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
Applicants:
INTEL IP CORPORATION [US/US]; 2200 Mission College Boulevard Santa Clara, California 95054, US
Inventors:
PATTEN, Richard; DE
WAIDHAS, Bernd; DE
KOLLER, Sonja; DE
Agent:
MARLINK, Jeffrey S.; US
AUYEUNG, Al; US
BLAIR, Steven R.; US
COFIELD, Michael A.; US
COWGER, Graciela G.; US
DANSKIN, Timothy A.; US
FORD, Stephen S.; US
GARTHWAITE, Martin S.; US
LEE, Katherine D.; US
MAKI, Nathan R.; US
MEININGER, Mark M.; US
MOORE, Michael S.; US
PARKER, Wesley E.; US
RASKIN, Vladimir; US
STRAUSS, Ryan N.; US
WANG, Yuke; US
Priority Data:
14/977,30721.12.2015US
Title (EN) FLIP-CHIP PACKAGE WITH THERMAL DISSIPATION LAYER
(FR) BOÎTIER À PUCE RETOURNÉE À COUCHE DE DISSIPATION THERMIQUE
Abstract:
(EN) Embodiments herein may relate to a flip-chip chip scale package (FCCSP) with a thermal dissipation layer to dissipate heat from the FCCSP during operation of the FCCSP. The thermal dissipation layer may be applied to a surface of the FCCSP through a sputter coating process and may operate as a heat spreader for the FCCSP. Other embodiments may be described and/or claimed.
(FR) Des modes de réalisation de l'invention peuvent concerner un boîtier à puce du type à puce retournée (FCCSP) comprenant une couche de dissipation thermique pour dissiper la chaleur du FCCSP pendant le fonctionnement de ce dernier. La couche de dissipation thermique peut être appliquée sur une surface du FCCSP par le biais d’un processus de revêtement par pulvérisation et peut fonctionner comme un dissipateur thermique pour le FCCSP. D'autres modes de réalisation peuvent être décrits et/ou revendiqués.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)