Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO2017111876) CONFIGURABLE INTERCONNECT APPARATUS AND METHOD
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/111876 International Application No.: PCT/US2015/000511
Publication Date: 29.06.2017 International Filing Date: 24.12.2015
IPC:
H01L 21/768 (2006.01) ,G06F 15/78 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70
Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
71
Manufacture of specific parts of devices defined in group H01L21/7086
768
Applying interconnections to be used for carrying current between separate components within a device
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
15
Digital computers in general; Data processing equipment in general
76
Architectures of general purpose stored programme computers
78
comprising a single central processing unit
Applicants:
INTEL CORPORATION [US/US]; 2200 Mission College Blvd. Santa Clara, CA 95054, US
Inventors:
MORRIS, Daniel, H.; US
AVCI, Uygar, E.; US
YOUNG, Ian, A.; US
Agent:
MUGHAL, Usman, A.; US
Priority Data:
Title (EN) CONFIGURABLE INTERCONNECT APPARATUS AND METHOD
(FR) APPAREIL D’INTERCONNEXION CONFIGURABLE ET PROCÉDÉ
Abstract:
(EN) Described is an apparatus which comprises: a first interconnect; a second interconnect; a third interconnect; a first via comprising a metal-insulator-transition (MIT) material, the first via to couple the first interconnect to the third interconnect; and a second via comprising the MIT material, the second via to couple the second interconnect to the third interconnect.
(FR) L'invention concerne un appareil qui comprend : une première interconnexion ; une deuxième interconnexion ; une troisième interconnexion ; un premier trou d'interconnexion comprenant un matériau de transition métal-isolant (IMT), le premier trou d'interconnexion servant à coupler la première interconnexion à la troisième interconnexion ; et un deuxième trou d'interconnexion comprenant le matériau IMT, le deuxième trou d'interconnexion servant à coupler la deuxième interconnexion à la troisième interconnexion.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)