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1. (WO2017111839) SWAGING PROCESS FOR COMPLEX INTEGRATED HEAT SPREADERS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/111839 International Application No.: PCT/US2015/000397
Publication Date: 29.06.2017 International Filing Date: 26.12.2015
IPC:
H01L 23/36 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
Applicants:
INTEL CORPORATION [US/US]; 2200 Mission College Boulevard Santa Clara, CA 95054, US
TANG, Zhizhong [CN/US]; US
KOURAKATA, Shinobu [JP/JP]; JP
OGATA, Kazuo [JP/JP]; JP
START, Paul, R. [US/US]; US
JIAN, Syadwad [IN/US]; US
LABANOK, William, Nicholas [US/US]; US
HU, Wei [CN/US]; US
LI, Peng [CN/US]; US
YOUNG, Douglas, R. [US/US]; US
CONSTABLE, Gregory, S. [US/US]; US
BEATTY, John, J. [US/US]; US
BHATTI, Pardeep, K. [US/US]; US
GARNER, Luke, J. [US/US]; US
ANTONISWAMY, Aravindha, R. [IN/US]; US
Inventors:
TANG, Zhizhong; US
KOURAKATA, Shinobu; JP
OGATA, Kazuo; JP
START, Paul, R.; US
JIAN, Syadwad; US
LABANOK, William, Nicholas; US
HU, Wei; US
LI, Peng; US
YOUNG, Douglas, R.; US
CONSTABLE, Gregory, S.; US
BEATTY, John, J.; US
BHATTI, Pardeep, K.; US
GARNER, Luke, J.; US
ANTONISWAMY, Aravindha, R.; US
Agent:
BRASK, Justin, K.; US
Priority Data:
Title (EN) SWAGING PROCESS FOR COMPLEX INTEGRATED HEAT SPREADERS
(FR) PROCÉDÉ DE MARTELAGE POUR DES DISSIPATEURS THERMIQUES INTÉGRÉS COMPLEXES
Abstract:
(EN) Embodiments are generally directed to a swaging process for complex integrated heat spreaders. An embodiment of an integrated heat spreader includes components, each of the components including one or more swage points; and a multiple swage joints, each swage joint including a swage pin joining two or more components, wherein components are joined into a single integrated heat spreader unit by the swage joints.
(FR) Des modes de réalisation selon l'invention concernent généralement un processus de martelage pour des dissipateurs thermiques intégrés complexes. Dans un mode de réalisation, un dissipateur thermique intégré comprend des éléments, chacun des éléments incluant un ou plusieurs points de martelage; et de multiples joints de martelage, chaque joint de martelage comportant une broche de martelage reliant au moins deux éléments, les éléments étant réunis en une seule unité de dissipateur thermique intégré par les joints de martelage.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
US20190043778