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1. (WO2017111834) GROUND PLANE VERTICAL ISOLATION OF, GROUND LINE COAXIAL ISOLATION OF, AND IMPEDANCE TUNING OF HORIZONTAL DATA SIGNAL TRANSMISSION LINES ROUTED THROUGH PACKAGE DEVICES
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/111834 International Application No.: PCT/US2015/000392
Publication Date: 29.06.2017 International Filing Date: 26.12.2015
IPC:
H01L 25/065 (2006.01) ,H01L 23/48 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
065
the devices being of a type provided for in group H01L27/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
Applicants:
INTEL CORPORATION [US/US]; 2200 Mission College Boulevard Santa Clara, CA 95054, US
Inventors:
ZHANG, Yu, Amos; US
REGALADO, Gabriel, S.; MX
QIAN, Zhiguo; US
AYGUN, Kemal; US
Agent:
BRASK, Justin, K.; US
Priority Data:
Title (EN) GROUND PLANE VERTICAL ISOLATION OF, GROUND LINE COAXIAL ISOLATION OF, AND IMPEDANCE TUNING OF HORIZONTAL DATA SIGNAL TRANSMISSION LINES ROUTED THROUGH PACKAGE DEVICES
(FR) ISOLATION VERTICALE DE PLAN DE MASSE, ISOLATION COAXIALE DE LIGNES DE MASSE ET ACCORD D'IMPÉDANCE DE LIGNES DE TRANSMISSION DE SIGNAUX DE DONNÉES HORIZONTALES ACHEMINÉES AU MOYEN DE DISPOSITIFS DE BOÎTIER
Abstract:
(EN) A ground isolation transmission line package device includes (1) ground isolation planes between, (2) ground isolation lines surrounding, or (3) such ground planes between and such ground isolation lines surrounding horizontal data signal transmission lines (e.g., metal signal traces) that are horizontally routed through the package device. The (1) ground isolation planes between, and/or (2) ground isolation lines electrically shield the data signals transmitted in signal lines, thus reducing signal crosstalk between and increasing electrical isolation of the data signal transmission lines. In addition, data signal transmission lines may be tuned using eye diagrams to select signal line widths and ground isolation line widths that provide optimal data transmission performance. This package device provides higher frequency and more accurate data signal transfer between different horizontal locations of the data signal transmission lines, and thus also between devices such as integrated circuit (IC) chips attached to the package device.
(FR) L'invention concerne un dispositif de boîtier de lignes de transmission d'isolation de masse qui comprend (1) des lignes d'isolation de masse entre, (2) des lignes d'isolation de masse entourant, ou (3) de tels plans de masse entre et de telles lignes d'isolation de masse entourant des lignes de transmission de signaux de données horizontales (par exemple des tracés de signaux métalliques) qui sont horizontalement acheminées au moyen du dispositif de boîtier. Les (1) plans d'isolation de masse entre, et/ou les (2) lignes d'isolation de masse protégent électriquement les signaux de données transmis dans des lignes de signaux, ce qui permet de réduire la diaphonie des signaux entre et d'augmenter l'isolation électrique des lignes de transmission de signaux de données. De plus, des lignes de transmission de signaux de données peuvent être accordées à l'aide de diagrammes de l'œil pour sélectionner des largeurs de lignes de signaux et des largeurs de lignes d'isolation de masse qui offrent des performances de transmission de données optimales. Ce dispositif de boîtier assure une fréquence plus élevée et un transfert de signaux de données plus précis entre différents emplacements horizontaux des lignes de transmission de signaux de données, et donc également entre des dispositifs tels que des puces de circuit intégré (CI) fixées au dispositif de boîtier.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
DE112015007234US20180374804