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1. (WO2017111786) NO-FLOW ADHESIVE FOR SECOND AND THIRD LEVEL INTERCONNECTS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/111786 International Application No.: PCT/US2015/000282
Publication Date: 29.06.2017 International Filing Date: 23.12.2015
IPC:
H01L 25/065 (2006.01) ,H01L 23/12 (2006.01) ,H01L 23/48 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
065
the devices being of a type provided for in group H01L27/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
Applicants:
INTEL CORPORATION [US/US]; 2200 Mission College Boulevard Santa Clara, CA 95054, US
Inventors:
SOOD, Mohit; US
XU, Huili; US
TAN, Wei; US
RAMALINGAM, Suriyakala; US
KRAJNIAK, Jan; US
ANANTHAKRISHNAN, Nisha; US
Agent:
BRASK, Justin, K.; US
Priority Data:
Title (EN) NO-FLOW ADHESIVE FOR SECOND AND THIRD LEVEL INTERCONNECTS
(FR) ADHÉSIF SANS ÉCOULEMENT DESTINÉ À DES INTERCONNEXIONS DE DEUXIÈME ET TROISIÈME NIVEAUX
Abstract:
(EN) An apparatus is described. The apparatus includes a first planar board to second planar board interface. The first planar board to second planar board interface includes a reflowed solder electrical connection structure between the first and second boards and a no flow adhesive. The reflowed solder electrical connection structure includes a reflowed solder ball and a reflowed tinned pad.
(FR) L'invention concerne un appareil. L'appareil comprend une interface entre une première carte plate et une seconde carte plate. L'interface entre la première carte plate et la seconde carte plate comprend une structure de connexion électrique à soudure refondue entre les première et seconde cartes et un adhésif sans écoulement. La structure de connexion électrique à soudure refondue comprend une bille de soudure refondue et une pastille étamée refondue.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
US20180324955