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1. (WO2017111349) FLIP CHIP MOUNTING DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/111349 International Application No.: PCT/KR2016/014190
Publication Date: 29.06.2017 International Filing Date: 05.12.2016
IPC:
H05K 13/04 (2006.01) ,H05K 3/30 (2006.01) ,H05K 3/34 (2006.01) ,H01L 23/00 (2006.01) ,H01L 21/683 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13
Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
04
Mounting of components
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
34
by soldering
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
Applicants:
(주)제이티 JT CORPORATION [KR/KR]; 충청남도 천안시 서북구 직산읍 4산단3로 135 135, 4sandan 3-ro, Jiksan-eup Seobuk-gu, Cheonan-si, Chungcheongnam-do 31040, KR
Inventors:
유홍준 YOU, Hong Jun; KR
Agent:
특허법인주원 B&IP-JOOWON PATENT AND LAW FIRM; 서울시 강남구 언주로 711, 건설회관 9층 (논현동) (Nonhyeon-dong) 9th Floor, Construction Center, Eonju-ro 711, Gangnam-gu, Seoul 06050, KR
Priority Data:
10-2015-018324721.12.2015KR
Title (EN) FLIP CHIP MOUNTING DEVICE
(FR) DISPOSITIF DE MONTAGE DE PUCE RETOURNÉE
(KO) 플립칩 실장장치
Abstract:
(EN) The present invention relates to a flip chip mounting device, and more specifically, to a flip chip mounting device for flipping a device picked-up from a wafer and mounting same on a substrate. The present invention discloses a flip chip mounting device comprising: a loading member table (200) which transfers a loading member (60) in a horizontal direction; a flip module (400) which picks up, at pick-up location ①, a device (1) loaded on the loading member (60), flips the picked-up device (1) and transfers same to transfer location ② located on one side of the loading member table (200); a mounting unit (500) which is installed at an interval from transfer location ② and has positioned thereon a substrate (2) on which the device (1), located at transfer location ②, transferred from the flip module (400) is mounted; a flux dipping unit (700) which is installed between transfer location ② and the mounting unit (500) and has filled therein flux in which the lower surface of the device (1) is dipped before the device (1) is mounted on the substrate (2) positioned on the mounting unit (500); and a pair of device transport tools (600) which are installed so as to move consecutively from transfer location ② to the flux dipping unit (700) and to the mounting unit (500), then return to transfer location ②, and which pick up one or more of the device (1) at transfer location ②, flux-dip the device (1) at the flux dipping unit (700) and mount the device (1) at the mounting unit (500), wherein the pair of device transport tools (600) are provided so that the consecutive movement thereof from transfer location ② to the flux dipping unit (700) and to the mounting unit (500), and then the return thereof to transfer location ② occur so as to be mutually consecutive.
(FR) La présente invention concerne un dispositif de montage de puce retournée, et plus spécifiquement, un dispositif de montage de puce retournée pour retournement de dispositif capturé depuis une tranche et son montage sur un substrat. La présente invention porte également sur un dispositif de montage de puce retournée comprenant : une table d'élément de chargement (200) qui transfère un élément de chargement (60) dans une direction horizontale ; un module de retournement (400) qui capture, au point de capture ①, un dispositif (1) positionné sur l'élément de chargement (60), retourne le dispositif de capture (1) et le transfère vers l'emplacement de transfert ② situé sur un côté de la table d'élément de chargement (200) ; une unité de montage (500) qui est installée au niveau d'un intervalle depuis un emplacement de transfert ② et a positionné sur cette dernière un substrat (2) sur lequel le dispositif (1), situé au niveau de l'emplacement de transfert ②, transféré depuis le module de retournement (400) est monté ; une unité d'immersion en flux (700) qui est installée entre l'emplacement de transfert ② et l'unité de montage (500) et est remplie avec un flux dans lequel la surface inférieure du dispositif (1) est immergée avant que le dispositif (1) est monté sur le substrat (2) positionné sur l'unité de montage (500) ; et une paire d'outils de transport de dispositif (600) qui sont installées de façon à se déplacer consécutivement depuis l'emplacement de transfert ② vers l'unité d'immersion en flux (700) et vers l'unité de montage (500), puis regagner l'emplacement de transfert ②, et qui saisissent un ou plusieurs dispositifs (1) au niveau de l'emplacement de transfert ②, immergent en flux le dispositif (1) au niveau de l'unité d'immersion en flux (700) et monter le dispositif (1) au niveau de l'unité de montage (500), la paire d'outils de transport de dispositif (600) étant conçue de telle sorte que le mouvement consécutif de ceux-ci depuis l'emplacement de transfert ② vers l'unité de d'immersion en flux (700) et vers l'unité de montage (500), et puis son retour au niveau de l'emplacement de transfert ② se produisent de manière à être mutuellement consécutifs.
(KO) 본 발명은 플립칩 실장장치에 관한 것으로서, 보다 상세하게는 웨이퍼에서 픽업된 소자를 플립 후 기판에 실장하는 플립칩 실장장치에 관한 것이다. 본 발명은, 로딩부재(60)를 수평방향으로 이동하는 로딩부재테이블(200)과; 로딩부재(60)에 적재된 소자(1)를 픽업위치 ① 에서 픽업하고 픽업된 소자(1)를 플립하여 로딩부재테이블(200)의 일측에 위치된 전달위치 ② 로 이동하는 플립모듈(400)과; 전달위치 ② 와 간격을 두고 설치되며 전달위치 ② 에 위치된 플립모듈(400)로부터 전달받은 소자(1)가 실장되는 기판(2)이 위치되는 실장부(500)와; 전달위치 ② 및 실장부(500) 사이에 설치되며 실장부(500)에 위치된 기판(2)에 실장되기 전에 소자(1)의 저면이 디핑되는 플럭스가 담긴 플럭스디핑부(700)와; 전달위치 ②, 플럭스디핑부(700) 및 실장부(500)으로 순차적으로 이동된 후 다시 전달위치 ② 로 이동되도록 설치되며, 전달위치 ② 에서 하나 이상의 소자(1)의 픽업, 플럭스디핑부(700)에서 소자(1)의 플럭스 디핑, 실장부(500)에서 소자(1)의 실장을 수행하는 한 쌍의 소자이송툴(600)을 포함하며, 한 쌍의 소자이송툴(600)은, 전달위치 ②, 플럭스디핑부(700) 및 실장부(500)으로 순차적으로 이동된 후 다시 전달위치 ② 로의 이동이 서로 순차적으로 이루어지는 것을 특징으로 하는 플립칩 실장장치를 개시한다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)