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1. (WO2017111320) LIGHT-EMITTING ELEMENT PACKAGE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/111320 International Application No.: PCT/KR2016/013317
Publication Date: 29.06.2017 International Filing Date: 18.11.2016
IPC:
H01L 33/48 (2010.01) ,H01L 33/62 (2010.01) ,H01L 33/64 (2010.01) ,F21Y 101/00 (2016.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
62
Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
64
Heat extraction or cooling elements
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21
LIGHTING
Y
INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21L, F21S and F21V104
101
Point-like light sources
Applicants:
엘지이노텍(주) LG INNOTEK CO., LTD. [KR/KR]; 서울시 중구 후암로 98 98, Huam-ro Jung-gu Seoul 04637, KR
Inventors:
송윤수 SONG, Yun Soo; KR
Agent:
이승찬 LEE, Seung Chan; KR
Priority Data:
10-2015-018471423.12.2015KR
Title (EN) LIGHT-EMITTING ELEMENT PACKAGE
(FR) BOÎTIER D'ÉLÉMENT ÉLECTROLUMINESCENT
(KO) 발광 소자 패키지
Abstract:
(EN) A light-emitting element package according to an embodiment can comprise: a body; N (herein, N denotes a positive integer of 5 or more) number of upper pads disposed on the body to be spaced apart from each other; N-1 number of light-emitting element chips respectively arranged on N-1 number of upper pads of the N number of upper pads; and a plurality of first wires for electrically connecting the N-1 number of light-emitting element chips and the N number of upper pads by at least one of a plurality of wiring structures.
(FR) Selon un mode de réalisation, l'invention concerne un boîtier d'élément électroluminescent qui peut comprendre : un corps; un nombre N (dans ce mode de réalisation, N désigne un entier positif supérieur ou égal à 5) de plages supérieures disposées sur le corps de façon à être espacées l'une de l'autre; un nombre N-1 de puces d'élément électroluminescent disposées respectivement sur un nombre N-1 de plages supérieures du nombre N de plages supérieures; une pluralité de premiers fils pour connecter électriquement le nombre N-1 de puces d'élément électroluminescent et le nombre N de plages supérieures par au moins une structure de câblage d'une pluralité de structures de câblage.
(KO) 실시 예의 발광 소자 패키지는 몸체와, 몸체 위에서 서로 이격되어 배치된 N(여기서, N은 5이상의 양의 정수) 개의 상부 패드와, N개의 상부 패드 중 N-1개의 상부 패드에 각각 배치된 N-1개의 발광 소자 칩 및 N-1개의 발광 소자 칩과 N개의 상부 패드를 복수의 결선 구조 중 적어도 하나의 구조로 전기적으로 연결하는 복수의 제1 와이어를 포함할 수 있다.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)
Also published as:
US20180375005