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1. (WO2017111254) ELECTROMAGNETIC WAVE SHIELDING FILM AND MANUFACTURING METHOD THEREFOR
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/111254 International Application No.: PCT/KR2016/009600
Publication Date: 29.06.2017 International Filing Date: 29.08.2016
IPC:
H05K 9/00 (2006.01) ,B32B 15/088 (2006.01) ,B32B 7/12 (2006.01) ,H05K 1/02 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
9
Screening of apparatus or components against electric or magnetic fields
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
088
comprising polyamides
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
7
Layered products characterised by the relation between layers, i.e. products essentially comprising layers having different physical properties or products characterised by the interconnection of layers
04
characterised by the connection of layers
12
using an adhesive
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
Applicants:
주식회사 두산 DOOSAN CORPORATION [KR/KR]; 서울시 중구 장충단로 275 275 Jangchungdan-ro Jung-gu Seoul 04563, KR
Inventors:
박한성 PARK, Hansung; KR
박미정 PARK, Mijung; KR
김원겸 KIM, Wonkyum; KR
김진우 KIM, Jinwoo; KR
염태우 YUM, Taewoo; KR
Agent:
특허법인 한벗 HANBEOT PATENT & LAW FIRM; 서울시 서대문구 충정로 7 구세군빌딩 15층 15th Fl. Salvation Army Bldg. 7, Chungjeong-ro Seodaemun-gu Seoul 03737, KR
Priority Data:
10-2015-018293521.12.2015KR
Title (EN) ELECTROMAGNETIC WAVE SHIELDING FILM AND MANUFACTURING METHOD THEREFOR
(FR) FILM DE PROTECTION D'ONDE ÉLECTROMAGNÉTIQUE ET SON PROCÉDÉ DE FABRICATION
(KO) 전자파 차폐 필름 및 이의 제조방법
Abstract:
(EN) The present invention provides an electromagnetic wave shielding film comprising an insulating layer and a conductive adhesive layer and having an electromagnetic wave shielding ratio of 50 dB to 65 dB at a frequency of 1 GHz according to an ASTM 4935-1 method, wherein the conductive adhesive layer has a resistivity [ρd] value of 1.0E-04 to 3.7E-04 Ωcm under a condition where the conductive adhesive layer has a content of a conductive filler of 60-80% and has a thickness of 10μm. In the present invention, instead of employing a flame retardant as a component of a conductive adhesive layer, a conductive filler is adjusted in shape and content to increase the packing density thereof and to lower resistivity, thereby exhibiting excellent electromagnetic shielding performance, electrical conductivity, heat resistance, and mechanical properties.
(FR) La présente invention concerne un film de protection d'onde électromagnétique qui comporte une couche isolante et une couche adhésive conductrice et présentant une atténuation des ondes électromagnétiques de 50 dB à 65 dB à une fréquence de 1 GHz mesurée selon un procédé ASTM 4935-1, la couche adhésive conductrice présentant une valeur de résistivité [ρd] de 1,0 E-04 à 3,7 E-04 Ωcm dans des conditions où la couche adhésive conductrice a une teneur en charge conductrice de 60 à 80 % et une épaisseur de 10 μm. Dans la présente invention, au lieu d'utiliser un ignifuge comme composant d'une couche adhésive conductrice, une charge conductrice est ajustée en termes de forme et de teneur pour augmenter sa densité de tassement et pour réduire sa résistivité, ce qui lui permet de présenter une efficacité de protection électromagnétique, une conductivité électrique, une résistance à la chaleur et des propriétés mécaniques excellentes.
(KO) 본 발명은 절연층과 전도성 접착층을 포함하며, ASTM 4935-1법에 있어서 주파수 1GHz에서의 전자파 차폐율이 50 내지 65dB인 전자파 차폐 필름으로서, 전도성 접착층 내 도전성 필러의 함량이 60~80%이고, 두께가 10㎛인 조건 하에서, 상기 전도성 접착층의 비저항[ρd] 값이 1.0E-04 내지 3.7E-04 Ωcm 범위인 것을 특징으로 하는 전자파 차폐 필름을 제공한다. 본 발명에서는 전도성 접착층의 성분으로 사용되는 난연제를 사용하지 않는 대신 도전성 필러의 형상과 함량을 조절함으로써 패킹밀도를 높이고 비저항을 낮춰 전자파 차폐 성능이 우수하며, 또한 도전성, 내열성 및 기계적 물성이 우수하다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)