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1. (WO2017111125) PRINTED WIRING BOARD AND CAMERA MODULE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/111125 International Application No.: PCT/JP2016/088564
Publication Date: 29.06.2017 International Filing Date: 22.12.2016
IPC:
H05K 1/02 (2006.01) ,H01L 23/14 (2006.01) ,H01L 27/14 (2006.01) ,H04N 5/369 (2011.01) ,H05K 1/05 (2006.01) ,H05K 3/00 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
14
characterised by the material or its electrical properties
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14
including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
30
Transforming light or analogous information into electric information
335
using solid-state image sensors [SSIS]
369
SSIS architecture; Circuitry associated therewith
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
05
Insulated metal substrate
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
Applicants:
太陽誘電株式会社 TAIYO YUDEN CO., LTD. [JP/JP]; 東京都中央区京橋二丁目7番19号 7-19 Kyobashi 2-chome, Chuo-ku Tokyo 1040031, JP
Inventors:
杉山 裕一 SUGIYAMA, Yuichi; JP
宮崎 政志 MIYAZAKI, Masashi; JP
小林 浩之 KOBAYASHI, Hiroyuki; JP
Agent:
一色国際特許業務法人 ISSHIKI & CO.; 東京都港区三田三丁目11番36号 三田日東ダイビル Mita-Nitto Daibiru Bldg., 11-36, Mita 3-chome, Minato-ku, Tokyo 1080073, JP
Priority Data:
2015-25375425.12.2015JP
Title (EN) PRINTED WIRING BOARD AND CAMERA MODULE
(FR) CARTE DE CIRCUIT IMPRIMÉ ET MODULE D'APPAREIL DE PRISE DE VUES
(JA) プリント配線板、及びカメラモジュール
Abstract:
(EN) A large printed wiring board having: a metal core substrate comprising a plurality of individual pieces that are composed of a metal and have a rectangular top surface, a rectangular rear surface, and four side surfaces that connect the perimeters of the top surface and the rear surface, the individual pieces being arranged in a first direction and a second direction that intersects the first direction, the metal core substrate furthermore comprising a plurality of projecting pieces that are composed of the same material as the individual pieces and are provided integrally with the individual pieces, the plurality of projecting pieces being set back from the corner sections of the rectangles and connecting the side surfaces of adjacent individual pieces with each other; an insulating layer containing a reinforcing filler provided to the top surface and the rear surface of the metal core substrate; and a wiring pattern provided to the top surface of the insulating layer, wherein the printed wiring board is characterized in that the total length of the projecting pieces along the sides is 50% or more of the length of the sides.
(FR) La présente invention concerne une grande carte de circuit imprimé comportant : un substrat à âme métallique comprenant une pluralité de pièces individuelles qui sont composées d'un métal et présentent une surface supérieure rectangulaire, une surface arrière rectangulaire et quatre surfaces latérales qui relient les périmètres de la surface supérieure et de la surface arrière, les pièces individuelles étant agencées dans une première direction et une seconde direction qui croise la première direction, le substrat à âme métallique comprenant en outre une pluralité de pièces en saillie qui sont composées du même matériau que celui des pièces individuelles et sont disposées d'un seul tenant avec les pièces individuelles, la pluralité de pièces en saillie étant disposées en retrait des sections de coin des rectangles et reliant les surfaces latérales de pièces individuelles adjacentes les unes aux autres ; une couche isolante contenant une charge de renforcement disposée sur la surface supérieure et la surface arrière du substrat à âme métallique ; et un motif de câblage disposé sur la surface supérieure de la couche isolante, la carte de circuit imprimé étant caractérisée en ce que la longueur totale des pièces en saillie le long des côtés est égale ou supérieure à 50 % de la longueur des côtés.
(JA) 【解決手段】 金属から成り、矩形の表面、矩形の裏面および前記表面および裏面の周囲をつなぐ4つの側面からなる複数の個片が第1の方向および前記第1方向と直行する第2方向に配列され、前記個片と同一材料で一体に設けられ、前記矩形の角部から回避され、隣り合う個片の側面同士を接続する複数の突出片とから成る金属コア基板と、前記金属コア基板の表面と裏面に設けられる補強フィラーを含有する絶縁層と、前記絶縁層の表面に設けられた配線パターンとを有する大判のプリント配線板に於いて、前記突出片の側辺に沿う長さの合計は、前記側辺の長さの50%以上を占める事を特徴とする。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
JP2017204650JPWO2017111125JP2018037679CN108432352DE112016006058DE212016000255
US20180310401