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1. (WO2017110994) HIGH FREQUENCY MODULE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/110994 International Application No.: PCT/JP2016/088325
Publication Date: 29.06.2017 International Filing Date: 22.12.2016
IPC:
H03H 9/25 (2006.01) ,H03H 9/64 (2006.01) ,H03H 9/72 (2006.01)
H ELECTRICITY
03
BASIC ELECTRONIC CIRCUITRY
H
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9
Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
25
Constructional features of resonators using surface acoustic waves
H ELECTRICITY
03
BASIC ELECTRONIC CIRCUITRY
H
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9
Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
46
Filters
64
using surface acoustic waves
H ELECTRICITY
03
BASIC ELECTRONIC CIRCUITRY
H
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9
Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
70
Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common or source
72
Networks using surface acoustic waves
Applicants:
株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP/JP]; 京都府長岡京市東神足1丁目10番1号 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP
Inventors:
菅谷 行晃 SUGAYA, Yukiteru; JP
Agent:
吉川 修一 YOSHIKAWA, Shuichi; JP
傍島 正朗 SOBAJIMA, Masaaki; JP
Priority Data:
2015-25539525.12.2015JP
Title (EN) HIGH FREQUENCY MODULE
(FR) MODULE HAUTE FRÉQUENCE
(JA) 高周波モジュール
Abstract:
(EN) A high frequency module (300) is provided with: a module substrate (30) comprising an internal wiring pattern; and a surface acoustic wave filter (300A). The surface acoustic wave filter (300A) comprises a piezoelectric substrate (31), an electrode pattern (33) formed on the piezoelectric substrate (31), a support member (34) formed so as to surround the electrode pattern (33), and a cover member (351) that is formed on the support member (34) and that covers the electrode pattern (33), said electrode pattern (33) constituting a hollow space together with the support member (34) and the piezoelectric substrate (31). The module substrate (30), the cover member (351), and the piezoelectric substrate (31) are arranged in this order in the vertical direction of the module substrate (30). A grounded shield electrode (352) is formed on the surface of the cover member (351) facing the module substrate (30) or on the surface of the cover member (351) facing the piezoelectric substrate (31).
(FR) Cette invention concerne un module haute fréquence (300) comprenant : un substrat de module (30) comprenant un motif de câblage ; et un filtre à ondes acoustiques de surface (300A). Le filtre à ondes acoustiques de surface (300A) comprend un substrat piézoélectrique (31), un motif d'électrode (33) formé sur le substrat piézoélectrique (31), un élément de support (34) formé de manière à entourer le motif d'électrode (33), et un élément de couverture (351) qui est formé sur l'élément de support (34) et qui recouvre le motif d'électrode (33), ledit motif d'électrode (33) constituant un espace creux avec de l'élément de support (34)et le substrat piézoélectrique (31). Le substrat de module (30), l'élément de couverture (351) et le substrat piézoélectrique (31) sont agencés dans cet ordre dans la direction verticale du substrat de module (30). Une électrode d'écran mis à la terre (352) est formée sur la surface de l'élément de couverture (351) faisant face au substrat de module (30) (351) ou sur la surface de l'élément de couverture (351) orientée vers le substrat piézoélectrique (31).
(JA) 高周波モジュール(300)は、内部配線パターンを有するモジュール基板(30)と、弾性表面波フィルタ(300A)とを備え、弾性表面波フィルタ(300A)は、圧電基板(31)と、圧電基板(31)上に形成された電極パターン(33)と、電極パターン(33)を囲むように形成された支持部材(34)と、支持部材(34)上に形成されており支持部材(34)および圧電基板(31)と共に中空空間を構成する電極パターン(33)を覆うカバー部材(351)とを有し、モジュール基板(30)の垂直方向に、モジュール基板(30)、カバー部材(351)、圧電基板(31)の順に配置されており、カバー部材(351)のモジュール基板(30)に対向する面または圧電基板(31)に対向する面には、接地されたシールド電極(352)が形成されている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN108476016US20180302062