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1. (WO2017110985) SOLDER CONNECTION STRUCTURE AND FILM FORMING METHOD
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/110985 International Application No.: PCT/JP2016/088310
Publication Date: 29.06.2017 International Filing Date: 22.12.2016
IPC:
C23C 24/04 (2006.01) ,C23C 28/02 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
24
Coating starting from inorganic powder
02
by application of pressure only
04
Impact or kinetic deposition of particles
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
28
Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups C23C2/-C23C26/173
02
only coatings of metallic material
Applicants:
タツタ電線株式会社 TATSUTA ELECTRIC WIRE & CABLE CO., LTD. [JP/JP]; 大阪府東大阪市岩田町2丁目3番1号 2-3-1, Iwata-cho, Higashiosaka-shi, Osaka 5788585, JP
Inventors:
平野 正樹 HIRANO, Masaki; JP
Agent:
藤岡 隆浩 FUJIOKA, Takahiro; JP
Priority Data:
2015-25207724.12.2015JP
Title (EN) SOLDER CONNECTION STRUCTURE AND FILM FORMING METHOD
(FR) STRUCTURE DE CONNEXION PAR BRASURE ET PROCÉDÉ DE FORMATION DE FILM
(JA) 半田接続構造、および成膜方法
Abstract:
(EN) Provided are: a solder connection structure having improved solder wettability and including an aluminum base material; and a film forming method for forming, on the aluminum base material, a metal film having high solder wettability. The solder connection structure (50) comprises: an aluminum substrate (30); a Ni film (35) formed on the aluminum substrate by a cold spray method; and a mixed metal film (40) formed on the Ni film, by the cold spray method, by using a mixed powder material obtained by mixing Ni powder (41) and Sn powder (42).
(FR) La présente invention concerne une structure de connexion par brasure présentant une meilleure mouillabilité de brasure et comprenant un matériau de base en aluminium ; et un procédé de formation de film pour former, sur le matériau de base en aluminium, un film métallique à haute mouillabilité de brasure. La structure de connexion par brasure (50) comprend : un substrat d'aluminium (30) ; un film de Ni (35) formé sur le substrat d'aluminium par un procédé de pulvérisation à froid ; et un film métallique mixte (40) formé sur le film de Ni par le procédé de pulvérisation à froid, en utilisant un matériau en poudre mixte obtenu par mélange d'une poudre de Ni (41) et d'une poudre de Sn (42).
(JA) 半田濡れ性が向上した、アルミニウム基材を有する半田接続構造、および、アルミニウム基材上に半田濡れ性の高い金属膜を成膜する成膜方法を提供する。半田接続構造(50)は、アルミニウム基板(30)と、アルミニウム基板上にコールドスプレー法により成膜されたNi膜(35)と、Ni粉末(41)と、Sn粉末(42)とが混合された混合粉末材料を用いて、Ni膜上にコールドスプレー法により成膜された混合金属膜(40)と、を備える。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
EP3396021US20180361708