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1. (WO2017110948) CURABLE COMPOSITION, METHOD FOR PRODUCING CURABLE COMPOSITION, CURED PRODUCT, USE OF CURABLE COMPOSITION, AND OPTICAL DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/110948 International Application No.: PCT/JP2016/088246
Publication Date: 29.06.2017 International Filing Date: 21.12.2016
IPC:
C08L 83/08 (2006.01) ,C08K 5/544 (2006.01) ,C09J 11/06 (2006.01) ,C09J 183/04 (2006.01) ,C09K 3/10 (2006.01) ,C08G 77/385 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
08
containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
54
Silicon-containing compounds
544
containing nitrogen
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
06
organic
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
183
Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
04
Polysiloxanes
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
3
Materials not provided for elsewhere
10
for sealing or packing joints or covers
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
77
Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
04
Polysiloxanes
38
Polysiloxanes modified by chemical after-treatment
382
containing atoms other than carbon, hydrogen, oxygen or silicon
385
containing halogens
Applicants:
リンテック株式会社 LINTEC CORPORATION [JP/JP]; 東京都板橋区本町23‐23 23-23, Honcho, Itabashi-ku, Tokyo 1730001, JP
Inventors:
七島 祐 NANASHIMA Yutaka; JP
中山 秀一 NAKAYAMA Hidekazu; JP
宮脇 学 MIYAWAKI Manabu; JP
樫尾 幹広 KASHIO Mikihiro; JP
Agent:
大石 治仁 OHISHI Haruhito; JP
Priority Data:
2015-25031422.12.2015JP
Title (EN) CURABLE COMPOSITION, METHOD FOR PRODUCING CURABLE COMPOSITION, CURED PRODUCT, USE OF CURABLE COMPOSITION, AND OPTICAL DEVICE
(FR) COMPOSITION DURCISSABLE, PROCÉDÉ DE PRODUCTION D'UNE COMPOSITION DURCISSABLE, PRODUIT DURCI, UTILISATION D'UNE COMPOSITION DURCISSABLE, ET DISPOSITIF OPTIQUE
(JA) 硬化性組成物、硬化性組成物の製造方法、硬化物、硬化性組成物の使用方法、および光デバイス
Abstract:
(EN) The present invention relates to: a curable composition which contains a curable polysilsesquioxane compound having a repeating unit represented by formula R1-D-SiO3/2 (wherein R1 represents a fluoroalkyl group represented by composition formula CxH(2x-y+1)Fy; x represents an integer of 1-10; y represents an integer of from 2 to (2x + 1) (inclusive); and D represents a linking group (excluding an alkylene group) that bonds R1 and Si with each other, or a single bond) (component (A)), and a silane coupling agent having a nitrogen atom in each molecule (component (B)); a method for producing this curable composition; a cured product which is obtained by curing this curable composition; use of this curable composition as an adhesive for optical element fixing materials or as a sealing material for optical element fixing materials; and an optical device. The present invention provides a curable composition which forms a cured product that has low refractive index, while exhibiting excellent bondability and heat resistance; a method for producing this curable composition; a cured product which is obtained by curing this curable composition; use of this curable composition as an adhesive for optical element fixing materials or as a sealing material for optical element fixing materials; and an optical device.
(FR) La présente invention concerne : une composition durcissable contenant un composé polysilsesquioxane durcissable ayant un motif répété représenté par la formule R1-D-SiO3/2 (où R1 représente un groupe fluoroalkyle représenté par la formule de composition CxH (2x-y+1)Fy; x représente un entier de 1 à 10; y représente un entier de 2 à (2x + 1) (inclus); et D représente un groupe de liaison (à l'exclusion d'un groupe alkylène) qui lie R1 et Si l'un avec l'autre, ou une liaison simple) (composant (A)), et un agent de couplage au silane ayant un atome d'azote dans chaque molécule (composant (B)); un procédé de production de cette composition durcissable; un produit durci obtenu par durcissement de cette composition durcissable; l'utilisation de cette composition durcissable comme adhésif pour matériaux de fixation d'élément optique ou comme matériau d'étanchéité pour matériaux de fixation d'élément optique; et un dispositif optique. La présente invention concerne une composition durcissable qui forme un produit durci qui présente un faible indice de réfraction, tout en présentant une aptitude au collage et une résistance à la chaleur excellentes; un procédé de production de cette composition durcissable; un produit durci obtenu par durcissement de cette composition durcissable; l'utilisation de cette composition durcissable comme adhésif pour matériaux de fixation d'élément optique ou comme matériau d'étanchéité pour matériaux de fixation d'élément optique; et un dispositif optique.
(JA) 本発明は、(A)成分:式:R-D-SiO3/2で示される繰り返し単位を有する硬化性ポリシルセスキオキサン化合物〔式中、Rは、組成式:C(2x-y+1)で表されるフルオロアルキル基を表し、xは1~10の整数、yは2以上、(2x+1)以下の整数を表し、Dは、RとSiとを結合する連結基(ただし、アルキレン基を除く)又は単結合を表す。〕、及び、(B)成分:分子内に窒素原子を有するシランカップリング剤を含有する硬化性組成物とその製造方法、前記硬化性組成物を硬化してなる硬化物、前記硬化性組成物を、光素子固定材用接着剤又は光素子固定材用封止材として使用する方法、及び光デバイスである。本発明によれば、接着性及び耐熱性に優れ、かつ、低屈折率の硬化物になる硬化性組成物とその製造方法、前記硬化性組成物を硬化してなる硬化物、前記硬化性組成物を、光素子固定材用接着剤又は光素子固定材用封止材として使用する方法、及び光デバイスが提供される。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
MYPI 2018702091CN108368346KR1020180097619US20180355111