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1. (WO2017110947) CURABLE COMPOSITION, METHOD FOR PRODUCING CURABLE COMPOSITION, CURED PRODUCT, AND USE OF CURABLE COMPOSITION
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/110947 International Application No.: PCT/JP2016/088245
Publication Date: 29.06.2017 International Filing Date: 21.12.2016
IPC:
C08L 83/04 (2006.01) ,C08K 3/00 (2006.01) ,C08K 3/36 (2006.01) ,C08K 5/5435 (2006.01) ,C08K 5/544 (2006.01) ,C08K 9/06 (2006.01) ,C09J 11/00 (2006.01) ,C09J 183/04 (2006.01) ,C09K 3/10 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
34
Silicon-containing compounds
36
Silica
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
54
Silicon-containing compounds
541
containing oxygen
5435
containing oxygen in a ring
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
54
Silicon-containing compounds
544
containing nitrogen
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
9
Use of pretreated ingredients
04
Ingredients treated with organic substances
06
with silicon-containing compounds
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
183
Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
04
Polysiloxanes
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
3
Materials not provided for elsewhere
10
for sealing or packing joints or covers
Applicants:
リンテック株式会社 LINTEC CORPORATION [JP/JP]; 東京都板橋区本町23‐23 23-23, Honcho, Itabashi-ku, Tokyo 1730001, JP
Inventors:
中山 秀一 NAKAYAMA Hidekazu; JP
樫尾 幹広 KASHIO Mikihiro; JP
Agent:
大石 治仁 OHISHI Haruhito; JP
Priority Data:
2015-25031322.12.2015JP
Title (EN) CURABLE COMPOSITION, METHOD FOR PRODUCING CURABLE COMPOSITION, CURED PRODUCT, AND USE OF CURABLE COMPOSITION
(FR) COMPOSITION DURCISSABLE, PROCÉDÉ DE PRODUCTION D'UNE COMPOSITION DURCISSABLE, PRODUIT DURCI, ET UTILISATION DE LA COMPOSITION DURCISSABLE
(JA) 硬化性組成物、硬化性組成物の製造方法、硬化物、及び硬化性組成物の使用方法
Abstract:
(EN) The present invention relates to: a curable composition which contains a curable polysilsesquioxane compound having a repeating unit represented by formula (a-1) (component (A)), fine particles having an average primary particle diameter of 5-40 nm (component (B)), and fine particles having an average primary particle diameter of more than 0.04 ìm but 8 ìm or less (component (C)); a method for producing this curable composition; a cured product which is obtained by curing this curable composition; and use of this curable composition as an adhesive for optical element fixing materials or as a sealing material for optical element fixing materials. The present invention provides a curable composition which exhibits excellent workability during a coating step and provides a cured product that has excellent bondability, peeling resistance and heat resistance; a method for producing this curable composition; a cured product which is obtained by curing this curable composition; and use of this curable composition as an adhesive for optical element fixing materials or as a sealing material for optical element fixing materials. In formula (a-1), R1 represents a substituted or unsubstituted alkyl group having 1-10 carbon atoms or a substituted or unsubstituted aryl group. R1SiO3/2 (a-1)
(FR) La présente invention concerne : une composition durcissable qui contient un composé polysilsesquioxane durcissable ayant un motif de répétition représenté par la formule (a-1) (composant (A)), de fines particules ayant un diamètre moyen des particules primaires de 5 à 40 nm (composant (B)), et des particules fines ayant un diamètre moyen des particules primaires supérieur à 0,04 ìm mais inférieur ou égal à 8 ìm (composant (C)); un procédé de production de cette composition durcissable; un produit durci qui est obtenu par durcissement de cette composition durcissable; et l'utilisation de cette composition durcissable comme adhésif pour matériaux de fixation d'élément optique ou comme matériau d'étanchéité pour matériaux de fixation d'élément optique. La présente invention concerne une composition durcissable qui présente une excellente aptitude à la transformation durant une étape de revêtement et qui fournit un produit durci présentant une excellente aptitude à la liaison, une excellente résistance au décollement et une excellente résistance à la chaleur; un procédé de production de cette composition durcissable; un produit durci qui est obtenu par durcissement de cette composition durcissable; et l'utilisation de cette composition durcissable comme adhésif pour matériaux de fixation d'élément optique ou comme matériau d'étanchéité pour matériaux de fixation d'élément optique. Dans la formule (a-1), R1 représente un groupe alkyle substitué ou non substitué ayant de 1 à 10 atomes de carbone ou un groupe aryle substitué ou non substitué. R1SiO3/2 (a-1)
(JA) 本発明は、(A)成分:下記式(a-1)で示される繰り返し単位を有する硬化性ポリシルセスキオキサン化合物、(B)成分:平均一次粒子径が5~40nmの微粒子、及び、(C)成分:平均一次粒子径が0.04μm超、8μm以下の微粒子を含有する硬化性組成物とその製造方法、前記硬化性組成物を硬化してなる硬化物、並びに、前記硬化性組成物を光素子固定材用接着剤又は光素子固定材用封止材として使用する方法である。本発明によれば、接着性、耐剥離性、及び耐熱性に優れる硬化物を与え、かつ、塗布工程における作業性に優れる硬化性組成物とその製造方法、前記硬化性組成物を硬化してなる硬化物、及び前記硬化性組成物を光素子固定材用接着剤又は光素子固定材用封止材として使用する方法が提供される。式(a-1)中、Rは、置換基を有する、若しくは置換基を有さない炭素数1~10のアルキル基、又は、置換基を有する、若しくは置換基を有さないアリール基を表す。RSiO3/2 (a-1)
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
MYPI 2018701907CN108473767KR1020180098292