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1. (WO2017110786) LASER PROCESSING DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/110786 International Application No.: PCT/JP2016/087897
Publication Date: 29.06.2017 International Filing Date: 20.12.2016
IPC:
B23K 26/02 (2014.01) ,B23K 26/00 (2014.01) ,B23K 26/03 (2006.01) ,B23K 26/082 (2014.01) ,G02B 26/08 (2006.01) ,G02B 26/10 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
02
Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
02
Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
03
Observing the workpiece
[IPC code unknown for B23K 26/082]
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
26
Optical devices or arrangements using movable or deformable optical elements for controlling the intensity, colour, phase, polarisation or direction of light, e.g. switching, gating, modulating
08
for controlling the direction of light
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
26
Optical devices or arrangements using movable or deformable optical elements for controlling the intensity, colour, phase, polarisation or direction of light, e.g. switching, gating, modulating
08
for controlling the direction of light
10
Scanning systems
Applicants:
ブラザー工業株式会社 BROTHER KOGYO KABUSHIKI KAISHA [JP/JP]; 愛知県名古屋市瑞穂区苗代町15番1号 15-1,Naeshiro-cho,Mizuho-ku,Nagoya-shi, Aichi 4678561, JP
Inventors:
西川 恭生 NISHIKAWA Yasuo; JP
古川 幸喜 FURUKAWA Koki; JP
Priority Data:
2015-25198724.12.2015JP
Title (EN) LASER PROCESSING DEVICE
(FR) DISPOSITIF DE TRAITEMENT À LASER
(JA) レーザ加工装置
Abstract:
(EN) The present invention provides a laser processing device (100) for processing a workpiece (W) by laser light (L) that can draw by means of guide light (M) a guide pattern that can contribute to high precision alignment of the workpiece (W). The laser processing device (100) has a laser oscillation unit (12), a guide light unit (17), a galvano scanner (19), a fθ lens (20), a laser controller (5), and a PC (7). Part of the outline of the workpiece (W) is extracted as feature points (P) on the basis of workpiece outline information acquired in workpiece outline information acquisition processing (S1), and a guide pattern indicating the placement position of the workpiece (W) is generated (S3) on the basis of each feature point (P) extracted in feature point extraction processing (S2). The laser processing device (100) draws (S6) by means of guide light (M) a guide pattern corresponding to the actual outline of the workpiece (W) according to the guide pattern information that has been generated.
(FR) La présente invention concerne un dispositif de traitement à laser (100) pour traiter une pièce de fabrication (W) par une lumière laser (L) qui peut tracer, au moyen d'une lumière de guidage (M), un motif de guidage qui peut contribuer à un alignement à haute précision de la pièce de fabrication (W). Le dispositif de traitement à laser (100) comporte une unité d'oscillation laser (12), une unité de lumière de guidage (17), un scanner galvanométrique (19), une lentille fθ (20), un dispositif de commande de laser (5), et un PC (7). Une partie du contour de la pièce de fabrication (W) est extraite sous forme de points caractéristiques (P) sur la base d'informations de contour de pièce de fabrication acquises dans un traitement d'acquisition d'informations de contour de pièce de fabrication (S1), et un motif de guidage indiquant la position de placement de la pièce de fabrication (W) est généré (S3) sur la base de chaque point caractéristique (P) extrait dans le traitement d'extraction de points caractéristiques (S2). Le dispositif de traitement à laser (100) trace (S6), au moyen d'une lumière de guidage (M), un motif de guidage correspondant au contour réel de la pièce de fabrication (W) conformément aux informations de motif de guidage qui ont été générées.
(JA) レーザ光(L)によるワーク(W)を加工するレーザ加工装置(100)に関し、高精度なワーク(W)の位置調整に貢献し得るガイドパターンをガイド光(M)により描画可能なレーザ加工装置(100)を提供する。レーザ加工装置(100)は、レーザ発振ユニット(12)と、ガイド光部(17)と、ガルバノスキャナ(19)と、fθレンズ(20)と、レーザコントローラ(5)と、PC(7)とを有する。ワーク輪郭情報取得処理(S1)によって取得されたワーク輪郭情報に基づいて、前記ワーク(W)の輪郭における一部を特徴点(P)として抽出し、特徴点抽出処理(S2)によって抽出された各特徴点(P)に基づいて、前記ワーク(W)の設置位置を示すガイドパターンを生成する(S3)。レーザ加工装置(100)は、生成したガイドパターン情報に従って、実際のワーク(W)の輪郭に応じたガイドパターンを、ガイド光(M)によって描画する(S6)。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)