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1. (WO2017110759) COPPER ALLOY PLATE FOR HEAT-DISSIPATION COMPONENT
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/110759 International Application No.: PCT/JP2016/087840
Publication Date: 29.06.2017 International Filing Date: 19.12.2016
IPC:
C22C 9/06 (2006.01) ,C22C 9/00 (2006.01) ,C22C 9/01 (2006.01) ,C22C 9/02 (2006.01) ,C22C 9/04 (2006.01) ,C22C 9/05 (2006.01) ,C22C 9/10 (2006.01) ,C22F 1/08 (2006.01) ,H01L 23/373 (2006.01) ,C22F 1/00 (2006.01)
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
9
Alloys based on copper
06
with nickel or cobalt as the next major constituent
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
9
Alloys based on copper
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
9
Alloys based on copper
01
with aluminium as the next major constituent
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
9
Alloys based on copper
02
with tin as the next major constituent
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
9
Alloys based on copper
04
with zinc as the next major constituent
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
9
Alloys based on copper
05
with manganese as the next major constituent
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
9
Alloys based on copper
10
with silicon as the next major constituent
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
F
CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS
1
Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
08
of copper or alloys based thereon
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373
Cooling facilitated by selection of materials for the device
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
F
CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS
1
Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
Applicants:
株式会社神戸製鋼所 KABUSHIKI KAISHA KOBE SEIKO SHO (KOBE STEEL, LTD.) [JP/JP]; 兵庫県神戸市中央区脇浜海岸通二丁目2番4号 2-4, Wakinohama-Kaigandori 2-chome, Chuo-ku, Kobe-shi, Hyogo 6518585, JP
Inventors:
橋本 大輔 HASHIMOTO, Daisuke; --
西村 昌泰 NISHIMURA, Masayasu; --
Agent:
鮫島 睦 SAMEJIMA, Mutsumi; JP
山尾 憲人 YAMAO, Norihito; JP
Priority Data:
2015-25464525.12.2015JP
2016-17546408.09.2016JP
Title (EN) COPPER ALLOY PLATE FOR HEAT-DISSIPATION COMPONENT
(FR) PLAQUE D'ALLIAGE DE CUIVRE POUR ÉLÉMENT DE DISSIPATION DE CHALEUR
(JA) 放熱部品用銅合金板
Abstract:
(EN) Provided is a copper alloy plate with which it is possible to impart adequate strength and heat-dissipation performance to a manufactured heat-dissipation component when a process for heating to a temperature of at least 650°C is included in part of a process for manufacturing the heat-dissipation component. The copper alloy plate contains 0.2-0.95% by mass of Ni, 0.05-0.8% by mass of Fe, and 0.03-0.2% by mass of P. Taking "[Ni+Fe]" to be the total Ni and Fe content and "[P]" to be the P content, the copper alloy plate comprises 0.25-1.0% by mass of [Ni+Fe], and the ratio [Ni+Fe]/[P] is 2-10, the balance being Cu and unavoidable impurities. This copper alloy plate has a 0.2% proof strength of at least 100 MPa and exceptional bendability. Once the copper alloy plate has been subjected to an aging process that includes heating at 850°C for 30 minutes, subsequent water cooling, and then heating at 500°C for two hours, the 0.2% proof strength is at least 120 MPa or higher, and the conductivity is at least 40% IACS.
(FR) L'invention concerne une plaque d'alliage de cuivre avec laquelle il est possible de conférer une résistance et une performance de dissipation de chaleur suffisantes à un élément de dissipation de chaleur fabriqué lorsqu'un processus de chauffage à une température d'au moins 650 °C est compris dans une partie d'un procédé de fabrication de l'élément de dissipation de chaleur. La plaque d'alliage de cuivre contient 0,2 à 0,95 % en masse de Ni, 0,05 à 0,8 % en masse de Fe et 0,03 à 0,2 % en masse de P. Si on désigne par "[Ni + Fe]" la teneur totale en Ni et Fe et par "[P]" la teneur en P, la plaque d'alliage de cuivre comprend 0,25 à 1,0 % en masse de [Ni + Fe] et le rapport [Ni + Fe]/[P] est de 2 à 10, le reste étant du Cu et des impuretés inévitables. Cette plaque d'alliage de cuivre présente une résistance à la charge d'épreuve à 0,2 % d'au moins 100 MPa et une exceptionnelle aptitude au pliage. Une fois que la plaque d'alliage de cuivre a été soumise à un processus de vieillissement qui comprend un chauffage à 850 °C pendant 30 minutes, suivi d’un refroidissement à l'eau, puis un chauffage à 500 °C pendant deux heures, la résistance à la charge d'épreuve à 0,2 % est d'au moins 120 MPa ou plus et la conductivité est d'au moins 40 % IACS.
(JA) 放熱部品を製造するプロセスの一部に650℃以上の温度に加熱するプロセスが含まれる場合に、製造後の放熱部品に十分な強度と放熱性能を持たせることができる銅合金板を提供する。 Ni:0.2~0.95質量%及びFe:0.05~0.8質量%と、P:0.03~0.2質量%を含有し、Ni及びFeの合計含有量を[Ni+Fe]とし、Pの含有量を[P]としたとき、[Ni+Fe]が0.25~1.0質量%、かつ[Ni+Fe]/[P]が2~10であり、残部がCu及び不可避不純物からなる銅合金板。この銅合金板は、0.2%耐力が100MPa以上で優れた曲げ加工性を有し、850℃で30分加熱後水冷し、次いで500℃で2時間加熱する時効処理をした後の0.2%耐力が120MPa以上、導電率が40%IACS以上である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
KR1020180081609CN108368566