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1. (WO2017110639) HIGH-FREQUENCY MODULE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/110639 International Application No.: PCT/JP2016/087318
Publication Date: 29.06.2017 International Filing Date: 14.12.2016
IPC:
H03H 9/72 (2006.01) ,H03H 7/46 (2006.01) ,H03H 9/25 (2006.01) ,H04B 1/38 (2015.01) ,H04B 1/525 (2015.01)
H ELECTRICITY
03
BASIC ELECTRONIC CIRCUITRY
H
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9
Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
70
Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common or source
72
Networks using surface acoustic waves
H ELECTRICITY
03
BASIC ELECTRONIC CIRCUITRY
H
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
7
Multiple-port networks comprising only passive electrical elements as network components
46
Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
H ELECTRICITY
03
BASIC ELECTRONIC CIRCUITRY
H
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9
Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
25
Constructional features of resonators using surface acoustic waves
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
B
TRANSMISSION
1
Details of transmission systems, not covered by a single one of groups H04B3/-H04B13/123; Details of transmission systems not characterised by the medium used for transmission
38
Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
[IPC code unknown for H04B 1/525]
Applicants:
株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP/JP]; 京都府長岡京市東神足1丁目10番1号 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP
Inventors:
松本 直也 MATSUMOTO, Naoya; JP
小野寺 修一 ONODERA, Syuichi; JP
上野 晃一 UENO, Koichi; JP
溝口 真也 MIZOGUCHI, Shinya; JP
武部 正英 TAKEBE, Masahide; JP
Agent:
吉川 修一 YOSHIKAWA, Shuichi; JP
傍島 正朗 SOBAJIMA, Masaaki; JP
Priority Data:
2015-25544525.12.2015JP
Title (EN) HIGH-FREQUENCY MODULE
(FR) MODULE À HAUTE FRÉQUENCE
(JA) 高周波モジュール
Abstract:
(EN) A high-frequency module (10) for filtering signals transmitted and received via an antenna, wherein said module (10) is provided with an antenna terminal (11), a transmission terminal (12), a receiving terminal (13), a receiving filter (15) connected between the antenna terminal (11) and the receiving terminal (13), a transmission filter (14) connected between the antenna terminal (11) and the transmission terminal (12), a first element (16) connected between the antenna terminal (11) and the transmission filter (14), and a second element (17) connected in series between the transmission terminal (12) and the transmission filter (14), the first element (16) and the second element (17) being capacitively coupled.
(FR) L'invention concerne un module à haute fréquence (10) pour le filtrage de signaux transmis et reçus par le biais d'une antenne, ledit module (10) comprenant un terminal d'antenne (11), un terminal de transmission (12), un terminal de réception (13), un filtre de réception (15) relié entre le terminal d'antenne (11) et le terminal de réception (13), un filtre de transmission (14) relié entre le terminal d'antenne (11) et le terminal de transmission (12), un premier élément (16) relié entre le terminal d'antenne (11) et le filtre de transmission (14) et un second élément (17) relié en série entre le terminal de transmission (12) et le filtre de transmission (14), le premier élément (16) et le second élément (17) étant couplés de manière capacitive.
(JA) アンテナで送受信される信号をフィルタリングする高周波モジュール(10)であって、アンテナ端子(11)と、送信端子(12)と、受信端子(13)と、アンテナ端子(11)と受信端子(13)との間に接続された受信フィルタ(15)と、アンテナ端子(11)と送信端子(12)との間に接続された送信フィルタ(14)と、アンテナ端子(11)と送信フィルタ(14)との間に接続される第1素子(16)と、送信端子(12)と送信フィルタ(14)との間に直列に接続される第2素子(17)とを備え、第1素子(16)と第2素子(17)とは、容量結合している。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)