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1. (WO2017110623) SILICONE RESIN COMPOSITION AND SEALING MATERIAL FOR SEMICONDUCTOR LIGHT EMITTING ELEMENT
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/110623 International Application No.: PCT/JP2016/087244
Publication Date: 29.06.2017 International Filing Date: 14.12.2016
IPC:
C08L 83/04 (2006.01) ,C08G 77/14 (2006.01) ,C08K 13/08 (2006.01) ,H01L 23/29 (2006.01) ,H01L 23/31 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
77
Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
04
Polysiloxanes
14
containing silicon bound to oxygen-containing groups
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
13
Use of mixtures of ingredients not covered by any single one of main groups C08K3/-C08K11/128
08
Ingredients of unknown constitution and ingredients covered by the main groups C08K3/-C08K9/131
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
29
characterised by the material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
31
characterised by the arrangement
Applicants:
住友化学株式会社 SUMITOMO CHEMICAL COMPANY, LIMITED [JP/JP]; 東京都中央区新川二丁目27番1号 27-1, Shinkawa 2-chome, Chuo-ku, Tokyo 1048260, JP
Inventors:
堀田 翔平 HOTTA, Shohei; JP
高島 正之 TAKASHIMA, Masayuki; JP
Agent:
中山 亨 NAKAYAMA, Tohru; JP
坂元 徹 SAKAMOTO, Toru; JP
Priority Data:
2015-24896921.12.2015JP
Title (EN) SILICONE RESIN COMPOSITION AND SEALING MATERIAL FOR SEMICONDUCTOR LIGHT EMITTING ELEMENT
(FR) COMPOSITION DE RÉSINE DE SILICONE ET MATÉRIAU D'ÉTANCHÉITÉ POUR ÉLÉMENT SEMI-CONDUCTEUR ÉLECTROLUMINESCENT
(JA) シリコーン樹脂組成物および半導体発光素子用封止材
Abstract:
(EN) A silicone resin composition is provided which is useful in the production of a highly UV-stable cured product of a silicone resin composition. This silicone resin composition includes at least one silicone resin and satisfies conditions (i) to (iii) below. (i) The contained silicon atoms consist essentially of A3 silicon atoms, and A1 silicon atoms and/or A2 silicon atoms, and the ratio of the content of A3 silicon atoms to the total content of the A1 silicon atoms through the A3 silicon atoms is 50-99 mol%. (ii) Side chains binding to the silicon atoms are alkyl groups, alkoxy groups or hydroxyl groups, the molar ratio of the alkoxy groups to the alkyl groups is less than 5 to 100, and the molar ratio of the hydroxyl groups to the alkyl groups is greater than or equal to 10 to 100. (iii) The composition is essentially free of metal catalysts and contains a curing catalyst that does not contain metals, wherein the concentration of the curing catalyst in the composition is less than or equal to 600ppm.
(FR) L'invention concerne une composition de résine de silicone qui est utile dans la production d'un produit durci hautement stable aux UV formé d'une composition de résine de silicone. Cette composition de résine de silicone comprend au moins une résine de silicone et respecte les conditions (i) à (iii) ci-dessous. (i) Les atomes de silicium présents à l'intérieur sont essentiellement constitués d'atomes de silicium A3, A1 et/ou A2, et le rapport entre la teneur en atomes de silicium A3 et la teneur totale en atomes de silicium A1 à A3 est égal à 50 à 99 % en moles. (ii) Les chaînes latérales se liant aux atomes de silicium sont des groupes alkyle, des groupes alcoxy ou des groupes hydroxyle, le rapport molaire entre les groupes alcoxy et les groupes alkyle est inférieur à 5/100, et le rapport molaire entre les groupes hydroxyle et les groupes alkyle est supérieur ou égal à 10/100. (iii) La composition est essentiellement exempte de catalyseurs métalliques et contient un catalyseur de durcissement qui ne contient pas de métaux, la concentration en catalyseur de durcissement de la composition étant inférieure ou égale à 600 ppm.
(JA) UV安定性が高いシリコーン樹脂組成物の硬化物の製造に有用なシリコーン樹脂組成物を提供する。 少なくとも1つのシリコーン樹脂を含むシリコーン樹脂組成物であって、 下記(i)~(iii)の要件を満たす、シリコーン樹脂組成物。 (i)含有するケイ素原子が、A1ケイ素原子および/またはA2ケイ素原子と、A3ケイ素原子とから実質的になり、A1ケイ素原子~A3ケイ素原子の合計含有量に対する、A3ケイ素原子の含有量の割合が、50モル%以上99モル%以下である。 (ii)前記ケイ素原子に結合する側鎖が、アルキル基、アルコキシ基または水酸基であり、アルコキシ基のモル比が、アルキル基100に対して5未満であり、水酸基のモル比が、アルキル基100に対して10以上である。 (iii)金属触媒を実質的に含有せず、且つ、金属を含まない硬化用触媒を含有し、組成物における硬化用触媒の濃度が、600ppm以下である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN108368341KR1020180097664