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1. (WO2017110622) SILICONE RESIN COMPOSITION AND SEALING MATERIAL FOR SEMICONDUCTOR LIGHT EMITTING ELEMENT
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/110622 International Application No.: PCT/JP2016/087243
Publication Date: 29.06.2017 International Filing Date: 14.12.2016
IPC:
C08L 83/06 (2006.01) ,C08G 77/14 (2006.01) ,C08L 83/04 (2006.01) ,H01L 23/29 (2006.01) ,H01L 23/31 (2006.01) ,H01L 33/56 (2010.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
06
containing silicon bound to oxygen-containing groups
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
77
Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
04
Polysiloxanes
14
containing silicon bound to oxygen-containing groups
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
29
characterised by the material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
31
characterised by the arrangement
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
56
Materials, e.g. epoxy or silicone resin
Applicants:
住友化学株式会社 SUMITOMO CHEMICAL COMPANY, LIMITED [JP/JP]; 東京都中央区新川二丁目27番1号 27-1, Shinkawa 2-chome, Chuo-ku, Tokyo 1048260, JP
Inventors:
堀田 翔平 HOTTA, Shohei; JP
高島 正之 TAKASHIMA, Masayuki; JP
Agent:
中山 亨 NAKAYAMA, Tohru; JP
坂元 徹 SAKAMOTO, Toru; JP
Priority Data:
2015-24896821.12.2015JP
Title (EN) SILICONE RESIN COMPOSITION AND SEALING MATERIAL FOR SEMICONDUCTOR LIGHT EMITTING ELEMENT
(FR) COMPOSITION DE RÉSINE DE SILICONE ET MATÉRIAU D'ÉTANCHÉITÉ POUR ÉLÉMENT SEMI-CONDUCTEUR ÉLECTROLUMINESCENT
(JA) シリコーン樹脂組成物および半導体発光素子用封止材
Abstract:
(EN) A silicone resin composition is provided which is useful in the production of a highly UV-stable cured product of a silicone resin composition. This silicone resin composition includes at least one silicone resin and satisfies conditions (i) to (iii) below. (i) The contained silicon atoms consist essentially of A3 silicon atoms and at least one type of silicon atom selected from the group consisting of A1 silicon atoms and A2 silicon atoms, and the ratio of the content of A3 silicon atoms to the total content of A1 silicon atoms, A2 silicon atoms and A3 silicon atoms is 50-99 mol%. (ii) Side chains binding to the silicon atoms are alkyl groups of 1 to 3 carbon atoms, alkoxy groups of 1 or 2 carbon atoms, or hydroxyl groups, the molar ratio of the alkoxy groups to the alkyl groups is less than 5 to 100, and the molar ratio of the hydroxyl groups to the alkyl groups is greater than or equal to 10 to 100. (iii) Contains essentially no metal catalysts.
(FR) L'invention concerne une composition de résine de silicone qui est utile dans la production d'un produit durci hautement stable aux UV à base d'une composition de résine de silicone. Cette composition de résine de silicone contient au moins une résine de silicone et respecte les conditions (i) à (iii) ci-dessous. (i) Les atomes de silicium présents à l'intérieur sont essentiellement constitués d'atomes de silicium A3 et d'au moins un type d'atomes de silicium choisi dans le groupe constitué des atomes de silicium A1 et des atomes de silicium A2, et le rapport entre la teneur en atomes de silicium A3 et la teneur totale en atomes de silicium A1, A2 et A3 varie de 50 à 99 % en moles. (ii) Les chaînes latérales se liant aux atomes de silicium correspondent à des groupes alkyle comportant de 1 à 3 atomes de carbone, à des groupes alcoxy comportant de 1 à 2 atomes de carbone ou à des groupes hydroxyle, le rapport molaire entre les groupes alcoxy et les groupes alkyle est inférieur à 5/100, et le rapport molaire entre les groupes hydroxyle et les groupes alkyle est supérieur ou égal à 10/100. (iii) Ne contient essentiellement aucun catalyseur métallique.
(JA) UV安定性が高いシリコーン樹脂組成物の硬化物の製造に有用なシリコーン樹脂組成物を提供する。 少なくとも1つのシリコーン樹脂を含むシリコーン樹脂組成物であって、 下記(i)~(iii)の要件を満たす、シリコーン樹脂組成物。 (i)含有するケイ素原子が、A1ケイ素原子およびA2ケイ素原子からなる群から選ばれる少なくとも1種のケイ素原子と、A3ケイ素原子とから実質的になり、A1ケイ素原子、A2ケイ素原子およびA3ケイ素原子の合計含有量に対する、A3ケイ素原子の含有量の割合が、50モル%以上99モル%以下である。 (ii)前記ケイ素原子に結合する側鎖が、炭素数1~3のアルキル基、炭素数1若しくは2のアルコキシ基、または、水酸基であり、アルコキシ基のモル比が、アルキル基100に対して5未満であり、水酸基のモル比が、アルキル基100に対して10以上である。 (iii)金属触媒を実質的に含有しない。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN108368343KR1020180099737EP3395905US20180371247