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1. (WO2017110621) SILICONE RESIN COMPOSITION AND USE THEREOF
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/110621 International Application No.: PCT/JP2016/087242
Publication Date: 29.06.2017 International Filing Date: 14.12.2016
IPC:
C08L 83/06 (2006.01) ,C08G 77/14 (2006.01) ,H01L 33/56 (2010.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
06
containing silicon bound to oxygen-containing groups
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
77
Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
04
Polysiloxanes
14
containing silicon bound to oxygen-containing groups
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
56
Materials, e.g. epoxy or silicone resin
Applicants:
住友化学株式会社 SUMITOMO CHEMICAL COMPANY, LIMITED [JP/JP]; 東京都中央区新川二丁目27番1号 27-1, Shinkawa 2-chome, Chuo-ku, Tokyo 1048260, JP
Inventors:
堀田 翔平 HOTTA, Shohei; JP
高島 正之 TAKASHIMA, Masayuki; JP
Agent:
中山 亨 NAKAYAMA, Tohru; JP
坂元 徹 SAKAMOTO, Toru; JP
Priority Data:
2015-24896721.12.2015JP
Title (EN) SILICONE RESIN COMPOSITION AND USE THEREOF
(FR) COMPOSITION DE RÉSINE DE SILICONE ET SON UTILISATION
(JA) シリコーン樹脂組成物およびその使用
Abstract:
(EN) A silicone resin composition is provided which is useful in the production of a silicone resin cured product having high thermal shock resistance. This resin composition includes at least a silicone resin; the silicon atoms contained by the resin composition consist essentially of A3 silicon atoms and at least one type of silicon atom selected from the group consisting of A1 silicon atoms and A2 silicon atoms, and the ratio of the content of A3 silicon atoms to the total content of A1 silicon atoms, A2 silicon atoms and A3 silicon atoms is 50-99 mol%; side chains binding to the silicon atoms include alkyl groups of 1 to 3 carbon atoms and alkoxy groups of 1 or 2 carbon atoms, and the molar ratio of the alkoxy groups to the alkyl groups is greater than or equal to 5 to 100.
(FR) La présente invention concerne une composition de résine de silicone qui est utile dans la production d’un produit durci en résine de silicone présentant une résistance élevée aux chocs thermiques. Cette composition de résine comprend au moins une résine de silicone ; les atomes de silicone contenus dans la composition de résine sont essentiellement constitués d’atomes de silicium A3 et d’au moins un type d’atome de silicium sélectionné dans le groupe constitué des atomes de silicium A1 et des atomes de silicium A2, et le rapport de la teneur des atomes de silicium A3 à la teneur totale des atomes de silicium A1, des atomes de silicium A2 et des atomes de silicium A3 est de 50 à 99 % en mole ; les chaînes latérales de liaison aux atomes de silicium comprennent des groupes alkyle ayant de 1 à 3 atomes de carbone et des groupes alcoxy ayant 1 ou 2 atomes de carbone, et le rapport molaire des groupes alcoxy aux groupes alkyle est supérieur ou égal à 5 à 100.
(JA) 高い熱衝撃耐性を示すシリコーン系樹脂硬化物の製造に有用なシリコーン樹脂組成物を提供する。 シリコーン樹脂を含む樹脂組成物であって、 樹脂組成物が含有するケイ素原子が、A1ケイ素原子およびA2ケイ素原子からなる群から選ばれる少なくとも1種のケイ素原子と、A3ケイ素原子とから実質的になり、A1ケイ素原子、A2ケイ素原子およびA3ケイ素原子の合計含有量に対する、A3ケイ素原子の含有量の割合が、50モル%以上99モル%以下であり、前記ケイ素原子に結合する側鎖が、炭素数1~3のアルキル基と、炭素数1または2のアルコキシ基とを含み、アルコキシ基のモル比が、アルキル基100に対して5以上である、シリコーン樹脂組成物。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN108368344KR1020180099736EP3395904