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1. (WO2017110571) DEVICE WITH BUILT-IN COMPONENT, RFID TAG, AND METHOD FOR PRODUCING DEVICE WITH BUILT-IN COMPONENT
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/110571 International Application No.: PCT/JP2016/086968
Publication Date: 29.06.2017 International Filing Date: 13.12.2016
IPC:
G06K 19/077 (2006.01) ,G06K 19/02 (2006.01) ,H01Q 9/16 (2006.01) ,H04B 1/40 (2015.01) ,H05K 3/46 (2006.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
K
RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19
Record carriers for use with machines and with at least a part designed to carry digital markings
06
characterised by the kind of the digital marking, e.g. shape, nature, code
067
Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
07
with integrated circuit chips
077
Constructional details, e.g. mounting of circuits in the carrier
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
K
RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19
Record carriers for use with machines and with at least a part designed to carry digital markings
02
characterised by the selection of materials, e.g. to avoid wear during transport through the machine
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
9
Electrically-short aerials having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
04
Resonant aerials
16
with feed intermediate between the extremities of the aerial, e.g. centre-fed dipole
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
B
TRANSMISSION
1
Details of transmission systems, not covered by a single one of groups H04B3/-H04B13/123; Details of transmission systems not characterised by the medium used for transmission
38
Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
40
Circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
Applicants:
株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP/JP]; 京都府長岡京市東神足1丁目10番1号 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP
Inventors:
長村 誠 OSAMURA Makoto; JP
大坪 喜人 OTSUBO Yoshihito; JP
Agent:
特許業務法人 楓国際特許事務所 KAEDE PATENT ATTORNEYS' OFFICE; 大阪府大阪市中央区農人橋1丁目4番34号 1-4-34, Noninbashi, Chuo-ku, Osaka-shi, Osaka 5400011, JP
Priority Data:
2015-24870521.12.2015JP
Title (EN) DEVICE WITH BUILT-IN COMPONENT, RFID TAG, AND METHOD FOR PRODUCING DEVICE WITH BUILT-IN COMPONENT
(FR) DISPOSITIF À ÉLÉMENT INTÉGRÉ, ÉTIQUETTE RFID ET PROCÉDÉ POUR FABRIQUER UN DISPOSITIF À ÉLÉMENT INTÉGRÉ
(JA) 部品内蔵デバイス、RFIDタグ、および部品内蔵デバイスの製造方法
Abstract:
(EN) This device with a built-in component is provided with a laminate (11) of a plurality of thermoplastic resin layers and with an RFID IC chip (50) that is embedded in the laminate (11), wherein the RFID IC chip has input/output terminals, and the laminate (11) is provided with pad electrodes (21a, 21b), which are formed on a thermoplastic resin layer, from among the plurality of thermoplastic resin layers, that is different from the layer on which the input/output terminals of the RFID IC chip (50) are located, and a plurality of first via conductors (35a1, 35a2, 35b1, 35b2), which electrically connect the input/output terminals and the pad electrodes (21a, 21b) in an interlayer direction.
(FR) L’invention concerne un dispositif à élément intégré comportant un stratifié (11) d’une pluralité de couches de résine thermoplastique et une puce à circuits intégrés (IC) RFID (50) qui est intégrée dans le stratifié (11), la puce IC RFID ayant des bornes d’entrée/sortie, et le stratifié (11) comportant des électrodes de plot (21a, 21b), qui sont formées sur une couche de résine thermoplastique, parmi la pluralité de couches de résine thermoplastique, qui est différente de la couche sur laquelle les bornes d’entrée/sortie de la puce IC RFID (50) sont situées, et une pluralité de premiers conducteurs de trou traversant (35a1, 35a2, 35b1, 35b2), qui connectent électriquement les bornes d’entrée/sortie et les électrodes de plot (21a, 21b) dans une direction inter-couche.
(JA) 複数の熱可塑性樹脂層の積層体(11)、および積層体(11)に埋設されたRFID用ICチップ(50)を備える部品内蔵デバイスであって、RFID用ICチップ(50)は入出力端子を有し、積層体(11)には、複数の熱可塑性樹脂層のうち、RFID用ICチップ(50)の入出力端子が位置する層とは異なる熱可塑性樹脂層に形成されたパッド電極(21a,21b)、および、入出力端子とパッド電極(21a,21b)とを層間方向に導通させる、複数の第1ビア導体(35a1,35a2,35b1,35b2)を備える。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN208188872