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1. (WO2017110468) HEAT-CURABLE RESIN COMPOSITION
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/110468 International Application No.: PCT/JP2016/086335
Publication Date: 29.06.2017 International Filing Date: 07.12.2016
IPC:
C08L 83/14 (2006.01) ,C08L 83/05 (2006.01) ,C08L 83/07 (2006.01) ,H01L 23/29 (2006.01) ,H01L 23/31 (2006.01) ,H01L 33/56 (2010.01) ,C08G 77/50 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
14
in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
05
containing silicon bound to hydrogen
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
07
containing silicon bound to unsaturated aliphatic groups
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
29
characterised by the material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
31
characterised by the arrangement
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
56
Materials, e.g. epoxy or silicone resin
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
77
Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
48
in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
50
by carbon linkages
Applicants:
JNC株式会社 JNC CORPORATION [JP/JP]; 東京都千代田区大手町二丁目2番1号 2-1, Otemachi 2-chome, Chiyoda-ku, Tokyo 1008105, JP
Inventors:
松尾 孝志 MATSUO Takashi; JP
田島 昌夫 TAJIMA Akio; JP
市川 幸治 ICHIKAWA Koji; JP
阿山 亨一 AYAMA Koichi; JP
Priority Data:
2015-25155824.12.2015JP
Title (EN) HEAT-CURABLE RESIN COMPOSITION
(FR) COMPOSITION DE RÉSINE THERMODURCISSABLE
(JA) 熱硬化性樹脂組成物
Abstract:
(EN) The present invention addresses the problem of providing a heat-curable resin composition provided with a high refractive index, gas barrier properties, and thermal shock resistance, the heat-curable resin composition having exceptional reliability as an LED sealing material. The heat-curable resin composition contains the following components (A), (B), and (C). (A) A heat-curable resin that is a reactant of a silsesquioxane having an SiH group and an organopolysiloxane having two alkenyl groups, the heat-curable resin having an SiH group and an alkenyl group; (B) a straight-chain compound having an alkenyl group or an SiH group at both ends, having an allyl group in the main chain, and having a siloxane chain as a primary structure; and (C) a Pt catalyst.
(FR) La présente invention résoud le problème de préparation d’une résine thermodurcissable présentant un indice de réfraction élevé, des propriétés de barrière aux gaz, et une résistance aux chocs thermiques, la composition de résine thermodurcissable étant d'une exceptionnelle fiabilité en tant que matériau d’étanchéité de DEL. La composition de résine thermodurcissable contient les composants (A), (B), et (C) suivants. (A) Une résine thermodurcissable qui est un réactif d’un silsesquioxane possédant un groupe SiH et d'un organopolysiloxane présentant deux groupes alcényle, la résine thermodurcissable possédant un groupe SiH et un groupe alcényle ; (B) un composé à chaîne linéaire possédant un groupe alcényle ou un groupe SiH aux deux extrémités, possédant un groupe allyle dans la chaîne principale, et possédant une chaîne siloxane comme structure primaire ; et (C) un catalyseur Pt.
(JA) 高屈折率、ガスバリア性、耐冷熱衝撃性を兼ね備えた熱硬化性樹脂組成物であり、LED用封止材としての信頼性に優れる熱硬化性樹脂組成物を提供することを課題とする。 以下の(A)、(B)および(C)を含有する熱硬化性樹脂組成物とする。 (A) SiH基を有するシルセスキオキサンとアルケニル基を2個有するオルガノポリシロキサンとの反応物であって、SiH基とアルケニル基とを有する熱硬化性樹脂 (B) 両末端にアルケニル基またはSiH基を有し、主鎖にアリール基を有する、シロキサン鎖を主構造として持つ直鎖状の化合物 (C) Pt触媒
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
KR1020180096570