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1. (WO2017110464) FILM FORMATION APPARATUS AND FILM FORMATION METHOD
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/110464 International Application No.: PCT/JP2016/086307
Publication Date: 29.06.2017 International Filing Date: 07.12.2016
IPC:
C23C 14/54 (2006.01) ,C23C 14/50 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22
characterised by the process of coating
54
Controlling or regulating the coating process
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22
characterised by the process of coating
50
Substrate holders
Applicants:
コニカミノルタ株式会社 KONICA MINOLTA, INC. [JP/JP]; 東京都千代田区丸の内二丁目7番2号 2-7-2, Marunouchi, Chiyoda-ku, Tokyo 1007015, JP
Inventors:
地大 英隆 JIDAI, Hidetaka; JP
松田 亮二 MATSUDA, Ryoji; JP
Agent:
特許業務法人光陽国際特許事務所 KOYO INTERNATIONAL PATENT FIRM; 東京都千代田区有楽町一丁目1番3号 東京宝塚ビル17階 17F., Tokyo Takarazuka Bldg., 1-1-3, Yurakucho, Chiyoda-ku, Tokyo 1000006, JP
Priority Data:
2015-25102124.12.2015JP
Title (EN) FILM FORMATION APPARATUS AND FILM FORMATION METHOD
(FR) APPAREIL DE FORMATION DE FILM ET PROCÉDÉ DE FORMATION DE FILM
(JA) 成膜装置および成膜方法
Abstract:
(EN) Provided is a film formation apparatus which reduces a deviation from a desired film thickness. This film formation apparatus (1) forms a multilayer film including (n + 1) or more layers (n is a positive integer of 1 or more) . The film formation apparatus (1) is provided with: a drum (10) which rotates while supporting a substrate (50); a film formation mechanism (20) which performs a film formation process on the substrate (50); and a control mechanism (40) for controlling rotation of the drum (10). The control mechanism (40) calculates the number of rotations of the drum (10) on the basis of a desired thickness of a multilayer film, an initial film formation rate setting of the film formation mechanism (20) and an initial rotational speed setting of the drum (10) and adjusts the rotational speed of the drum (10) so that the calculated number of rotations of the drum (10) approaches an integer .
(FR) La présente invention concerne un appareil de formation de film qui réduit un écart par rapport à une épaisseur de films souhaitée. Cet appareil de formation de film (1) forme un film multicouche comprenant (n + 1) couches ou plus (n est un entier positif de 1 ou plus). L’appareil de formation de film (1) est pourvu de : un cylindre (10) qui tourne tout en soutenant un substrat (50) ; un mécanisme de formation de film (20) qui effectue un processus de formation de film sur le substrat (50) ; et un mécanisme de commande (40) pour commander la rotation du cylindre (10). Le mécanisme de commande (40) calcule le nombre de rotations du cylindre (10) sur la base d’une épaisseur souhaitée d’un film multicouche, un réglage de taux de formation de film initial du mécanisme de formation de film (20) et un réglage de vitesse de rotation initiale du cylindre (10) et ajuste la vitesse de rotation du cylindre (10) de sorte que le nombre calculé de rotations du cylindre (10) soit proche d’un entier.
(JA) 目標膜厚からのずれを低減する成膜装置を提供する。 成膜装置(1)は、(n+1)層以上(nは1以上の正の整数である。)の多層膜の成膜装置である。成膜装置(1)は、基板(50)を支持しながら回転するドラム(10)と、基板(50)に対し成膜処理を行う成膜機構(20)と、ドラム(10)の回転を制御する制御機構(40)であって、多層膜の目標膜厚、初期設定された成膜機構(20)の成膜レートおよび初期設定されたドラム(10)の回転速度からドラム(10)の回転数を算出し、ドラム(10)の回転速度を調整して、算出したドラム(10)の回転数を整数に近づける制御機構(40)と、を備える。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN108368604EP3396016