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1. (WO2017110432) REGULATION PLATE, PLATING APPARATUS PROVIDED WITH SAME, AND PLATING METHOD
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/110432 International Application No.: PCT/JP2016/086021
Publication Date: 29.06.2017 International Filing Date: 05.12.2016
IPC:
C25D 17/10 (2006.01) ,H01L 21/288 (2006.01)
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
17
Constructional parts, or assemblies thereof, of cells for electrolytic coating
10
Electrodes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
28
Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/268158
283
Deposition of conductive or insulating materials for electrodes
288
from a liquid, e.g. electrolytic deposition
Applicants:
株式会社荏原製作所 EBARA CORPORATION [JP/JP]; 東京都大田区羽田旭町11番1号 11-1, Haneda Asahi-cho, Ohta-ku, Tokyo 1448510, JP
Inventors:
中川 洋一 NAKAGAWA, Yoichi; JP
藤方 淳平 FUJIKATA, Jumpei; JP
Agent:
小野 新次郎 ONO, Shinjiro; JP
宮前 徹 MIYAMAE, Toru; JP
鐘ヶ江 幸男 KANEGAE, Yukio; JP
渡邊 誠 WATANABE, Makoto; JP
Priority Data:
2015-24838021.12.2015JP
Title (EN) REGULATION PLATE, PLATING APPARATUS PROVIDED WITH SAME, AND PLATING METHOD
(FR) PLAQUE DE RÉGULATION, APPAREIL DE PLACAGE POURVU DE CETTE DERNIÈRE ET PROCÉDÉ DE PLACAGE
(JA) レギュレーションプレート、これを備えためっき装置及びめっき方法
Abstract:
(EN) Provided are: a regulation plate capable of preventing a plurality of substrates which differ in properties and treatment conditions from being reduced in in-plane uniformity due to the terminal effect; and a plating apparatus provided with the same. According to one embodiment in the present invention, a regulation plate is provided for adjusting a current between an anode and a substrate to be plated . This regulation plate comprises: a plate main body having an opening through which the current passes; a plurality of first blades for restricting the diameter of the opening; and a first movement mechanism for moving the plurality of first blades in a translational manner in the radial direction of the opening.
(FR) L'invention concerne : une plaque de régulation apte à empêcher une pluralité de substrats, présentant des propriétés et des conditions de traitement différentes, de voir leur uniformité dans le plan réduite en raison de l'effet terminal ; et un appareil de placage pourvu de cette dernière. Selon un mode de réalisation de la présente invention, une plaque de régulation a pour but de réguler un courant entre une anode et un substrat à plaquer. Cette plaque de régulation comprend : un corps principal de plaque possédant une ouverture à travers laquelle passe le courant ; une pluralité de premières lames pour limiter le diamètre de l'ouverture ; et un premier mécanisme de déplacement pour déplacer la pluralité de premières lames en translation dans le sens radial de l'ouverture.
(JA) 特徴及び処理条件の異なる複数の基板に対して、ターミナルエフェクトの影響による面内均一性の低下を抑制し得るレギュレーションプレート及びこれを備えためっき装置を提供する。 本発明の一形態によれば、アノードとめっきされる基板との間の電流を調整するためのレギュレーションプレートが提供される。このレギュレーションプレートは、電流が通過する開口を有するプレート本体部と、前記開口の径を絞るための複数の第1ブレードと、前記複数の第1ブレードを前記開口の径方向に並進移動させる第1移動機構と、を有する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN108474132KR1020180090797