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1. (WO2017110422) PRESSURE SENSOR
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/110422 International Application No.: PCT/JP2016/085872
Publication Date: 29.06.2017 International Filing Date: 02.12.2016
IPC:
G01L 19/06 (2006.01) ,G01L 13/02 (2006.01) ,G01L 19/00 (2006.01)
G PHYSICS
01
MEASURING; TESTING
L
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
19
Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
06
Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
G PHYSICS
01
MEASURING; TESTING
L
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
13
Devices or apparatus for measuring differences of two or more fluid pressure values
02
using elastically-deformable members or pistons as sensing elements
G PHYSICS
01
MEASURING; TESTING
L
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
19
Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
Applicants:
アズビル株式会社 AZBIL CORPORATION [JP/JP]; 東京都千代田区丸の内2丁目7番3号 2-7-3,Marunouchi,Chiyoda-ku, Tokyo 1006419, JP
Inventors:
津嶋 鮎美 TSUSHIMA,Ayumi; JP
石倉 義之 ISHIKURA,Yoshiyuki; JP
徳田 智久 TOKUDA,Tomohisa; JP
木田 のぞみ KIDA,Nozomi; JP
瀬戸 祐希 SETO,Yuki; JP
Agent:
山川 茂樹 YAMAKAWA,Shigeki; JP
山川 政樹 YAMAKAWA,Masaki; JP
Priority Data:
2015-25362725.12.2015JP
Title (EN) PRESSURE SENSOR
(FR) DÉTECTEUR DE PRESSION
(JA) 圧力センサ
Abstract:
(EN) According to the present invention, a sensor chip (24) is joined to an inner wall surface (20a) of a base body (21-1) at the lower surface (24a) of a first holding member (24-2) as a joint surface, so that an enclosed chamber (23) (pressure receiving chamber (23-1) + pressure guiding path (23-2)) between a pressure receiving diaphragm (22) and the joint surface (24a) of the sensor chip (24) is connected to a pressure guiding hole (24-2b) in the first holding member (24-2). In this state, a stainless thin tube (31) penetrates though the pressure guiding path (23-2) in the base body (21-1), to be inserted and fixed in the pressure guiding hole (24-2b) in the first holding member (24-2). Accordingly, the pressure receiving area of the pressure guiding path, which guides the pressure (P1) of a fluid to be subjected to measurement to one surface (24-1a) of a sensor diaphragm (24-1), becomes small, a force in a direction to separate the joined sensor chip (24) and base body (21-1) from each other is suppressed, and thus, use of a soft adhesive is allowed.
(FR) La présente invention concerne une puce de capteur (24) fixée à une surface de paroi interne (20a) d'un corps de base (21-1) au niveau de la surface inférieure (24a) d'un premier élément de retenue (24-2) jouant le rôle de surface de joint, de telle sorte qu'une chambre fermée (23) (chambre de réception de pression (23-1) + trajet de guidage de pression (23-2)) entre un diaphragme de réception de pression (22) et la surface de joint (24a) de la puce de capteur (24) est raccordée à un orifice de guidage de pression (24-2b) se trouvant dans le premier élément de retenue (24-2). Dans cette configuration, un tube fin inoxydable (31) pénètre à travers le trajet de guidage de pression (23-2) dans le corps de base (21-1), à inséré et fixé dans l'orifice de guidage de pression (24-2b) se trouvant dans le premier élément de retenue (24-2). Par conséquent, la zone de réception de pression du trajet de guidage de pression, qui guide la pression (P1) d'un fluide devant être soumis à une mesure sur une surface (24-1a) d'un diaphragme de capteur (24-1), devient petite, une force capable de séparer la puce de capteur (24) et le corps de base (21-1) est supprimée, et donc il est possible d'utiliser un adhésif souple.
(JA) センサチップ(24)を第1の保持部材(24-2)の下面(24a)を接合面としてベースボディ(21-1)の内壁面(20a)に接合し、受圧ダイアフラム(22)とセンサチップ(24)の接合面(24a)との間の封入室(23)(受圧室(23-1)+導圧路(23-2))と第1の保持部材(24-2)の導圧孔(24-2b)とを連通させる。この状態で、ベースボディ(21-1)の導圧路(23-2)を貫いて、第1の保持部材(24-2)の導圧孔(24-2b)に、ステンレス製の細管(31)を挿入固定する。これにより、センサダイアフラム(24-1)の一方の面(24-1a)へ被測定流体の圧力(P1)を導く導圧路の受圧面積が小さくなり、センサチップ(24)とベースボディ(21-1)との接合を剥離する方向への力が抑えられ、軟接着剤の使用が可能となる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN108431570